scholarly journals Rate-range for an FH-FSK acoustic modem

2007 ◽  
Author(s):  
Nathan Parrish ◽  
Sumit Roy ◽  
Warren L. J. Fox ◽  
Payman Arabshahi
Keyword(s):  
Rate Range ◽  
Acoustic Modem

Deformation resistance and fracture of iron over a wide strain rate range

2014 ◽  
Vol 56 (8) ◽  
pp. 1569-1573 ◽  
Author(s):  
G. I. Kanel ◽  
S. V. Razorenov ◽  
G. V. Garkushin ◽  
S. I. Ashitkov ◽  
P. S. Komarov ◽  
...  
Keyword(s):  
Strain Rate ◽  
Strain Rate Range ◽  
Deformation Resistance ◽  
Rate Range

Estimation of Red Cell Deformability Based on Flow Curve of Whole Blood in the Higher Shear Rate Range.

2001 ◽  
Vol 27 (2) ◽  
pp. 228-235
Author(s):  
Shinichi Ookawara ◽  
Akihisa Yano ◽  
Kohei Ogawa ◽  
Koichi Taniguchi
Keyword(s):  
Shear Rate ◽  
Whole Blood ◽  
Flow Curve ◽  
Red Cell ◽  
Cell Deformability ◽  
Red Cell Deformability ◽  
Rate Range

Flying acoustic modem: Results and future concepts of operation

2018 ◽  
Author(s):  
Joao Galante ◽  
Paulo Sousa Dias ◽  
Manuel Ribeiro ◽  
Himanshi Jain ◽  
P.B. Sujit ◽  
...  
Keyword(s):  
Future Concepts ◽  
Acoustic Modem

NAMS: A networked acoustic modem system for underwater applications

2011 ◽  
Author(s):  
Zheng Peng ◽  
Haining Mo ◽  
Jun Liu ◽  
Zuofei Wang ◽  
Hao Zhou ◽  
...  
Keyword(s):  
Acoustic Modem

Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence

2005 ◽  
Vol 297-300 ◽  
pp. 905-911 ◽  
Author(s):  
Xu Chen ◽  
Li Zhang ◽  
Masao Sakane ◽  
Haruo Nose
Keyword(s):  
Tensile Stress ◽  
Constitutive Model ◽  
Strain Rate ◽  
Constant Strain Rate ◽  
Tensile Tests ◽  
Strain Rate Range ◽  
Rate Dependence ◽  
Strain Rates ◽  
Stress Strain ◽  
Rate Range

A series of tensile tests at constant strain rate were conducted on tin-lead based solders with different Sn content under wide ranges of temperatures and strain rates. It was shown that the stress-strain relationships had strong temperature- and strain rate- dependence. The parameters of Anand model for four solders were determined. The four solders were 60Sn-40Pb, 40Sn-60Pb, 10Sn-90Pb and 5Sn-95Pb. Anand constitutive model was employed to simulate the stress-strain behaviors of the solders for the temperature range from 313K to 398K and the strain rate range from 0.001%sP -1 P to 2%sP -1 P. The results showed that Anand model can adequately predict the rate- and temperature- related constitutive behaviors at all test temperatures and strain rates.

Sign in / Sign up

Export Citation Format

Share Document