J15 Thermoelectric Characteristic of Thin Film Thermocouples

2007 ◽  
Vol 2007.60 (0) ◽  
pp. 353-354
Author(s):  
Yusuke MORIWAKI ◽  
Tomohiro ICHIZONO ◽  
Hiroshi TSUKAMOTO ◽  
Koji MIYAZAKI
2012 ◽  
Vol 520 (17) ◽  
pp. 5801-5806 ◽  
Author(s):  
John D. Wrbanek ◽  
Gustave C. Fralick ◽  
Dongming Zhu

2006 ◽  
Vol 100 (11) ◽  
pp. 114905 ◽  
Author(s):  
M. Cattani ◽  
M. C. Salvadori ◽  
A. R. Vaz ◽  
F. S. Teixeira ◽  
I. G. Brown

10.2514/3.836 ◽  
1996 ◽  
Vol 10 (4) ◽  
pp. 607-612 ◽  
Author(s):  
J. Lepicovsky ◽  
R. J. Bruckner ◽  
F. A. Smith

2018 ◽  
Vol 30 (2) ◽  
pp. 1786-1793 ◽  
Author(s):  
Yantao Liu ◽  
Wei Ren ◽  
Peng Shi ◽  
Dan Liu ◽  
Yijun Zhang ◽  
...  

Author(s):  
Xudong Cheng ◽  
Patrick Schwieso ◽  
Hongseok Choi ◽  
Arindom Datta ◽  
Xiaochun Li

This work is to study micro thin film sensor embedding in metals for the production of miniature smart tooling. This technique promises to significantly improve the safety and reliability for manufacturing processes and reduce operation costs. One key concern of the current research is to investigate if sensor functionality can be maintained during and after embedding in metals by use of ultrasonic welding (USW), which could be hostile to micro thin film thermocouples (TFTCs) embedded near the welding interface. The welding workpieces, consisting of a nickel strip with embedded micro sensors and a copper thin sheet, were welded by USW process. Experimental results showed that TFTCs survived the ultrasonic welding process. The embedded TCFCs were also capable of measuring temperature in-situ near the weld interface during the embedding process.


2020 ◽  
Vol 91 (4) ◽  
pp. 045004
Author(s):  
Bian Tian ◽  
Zhaojun Liu ◽  
Cunfeng Wang ◽  
Yan Liu ◽  
Zhongkai Zhang ◽  
...  

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