3 Module design, materials, and production

2020 ◽  
pp. 47-104
Author(s):  
Harry Wirth ◽  
Karl-Anders Weiß ◽  
Cornelia Wiesmeier

Author(s):  
Clarence Rebello ◽  
Ted Kolasa ◽  
Parag Modi

Abstract During the search for the root cause of a board level failure, all aspects of the product must be revisited and investigated. These aspects encompass design, materials, and workmanship. In this discussion, the failure investigation involved an S-Band Power Amplifier assembly exhibiting abnormally low RF output power where initial troubleshooting did not provide a clear cause of failure. A detailed fault tree drove investigations that narrowed the focus to a few possible root causes. However, as the investigation progressed, multiple contributors were eventually discovered, some that were not initially considered.


2011 ◽  
Vol 26 (12) ◽  
pp. 1261-1265 ◽  
Author(s):  
Hui MA ◽  
Zhi-Yong LIU ◽  
Yu-Ming LU ◽  
Xiao-Yan JIN ◽  
Chuan-Bing CAI

2012 ◽  
Vol 220-223 ◽  
pp. 1472-1475
Author(s):  
Qiu Lin Tan ◽  
Xiang Dong Pei ◽  
Si Min Zhu ◽  
Ji Jun Xiong

On the basis of automatic test system of the status in domestic and foreign, by analysis of the various functions and performance of the integrated test system, a design of the integrated test system is proposed, FPGA as the core logic controller of the hardware circuit. The system of the hardware design include: digital signal source output modules, analog output module and PCM codec module. Design of hardware circuit are mainly described. In addition, a detailed analysis of some key technologies in the design process was given. Overall, its data exchange with host computer is through the PCI card, data link and bandwidth can be expanded in accordance with the actual needs. The entire system designed in the modular principle, which has a strong scalability.


Author(s):  
T Surendran ◽  
K Nandini ◽  
R Nagalakshmi ◽  
J Johnsi

Author(s):  
Susan Motil ◽  
John Snead ◽  
DeVon Griffin ◽  
Edward Hovenac

2021 ◽  
Vol 2 (1) ◽  
Author(s):  
Daisuke Sato ◽  
Taizo Masuda ◽  
Kenji Araki ◽  
Masafumi Yamaguchi ◽  
Kenichi Okumura ◽  
...  

AbstractStretchable photovoltaics are emerging power sources for collapsible electronics, biomedical devices, and buildings and vehicles with curved surfaces. Development of stretchable photovoltaics are crucial to achieve rapid growth of the future photovoltaic market. However, owing to their rigidity, existing thin-film solar cells based predominantly on silicon, compound semiconductors, and perovskites are difficult to apply to 3D curved surfaces, which are potential real-world candidates. Herein, we present a stretchable micro-scale concentrator photovoltaic module with a geometrical concentration ratio of 3.5×. When perfectly fitted on a 3D curved surface with a sharp curvature, the prototype module achieves an outdoor power conversion efficiency of 15.4% and the daily generated electricity yield improves to a maximum of 190% relative to a non-concentration stretchable photovoltaic module. Thus, this module design enables high areal coverage on 3D curved surfaces, while generating a higher electricity yield in a limited installation area.


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