Special Technology Area Review on Microwave Packaging Technology

1993 ◽  
Author(s):  
Becky Terry
Keyword(s):  
Packaging Technology ◽  
Technology Area

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
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Packaging Technology ◽  
Wafer Level Packaging

Development of Silicon Wafer Packaging Technology for Deep UV LED

2020 ◽  
Vol 140 (7) ◽  
pp. 152-157
Author(s):  
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Yukio Suzuki ◽  
Yoshiaki Yasuda ◽  
Mitsuyasu Kumagai ◽  
Takaaki Koyama ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Packaging Technology ◽  
Uv Led ◽  
Deep Uv

Special Technology Area Review on Computer Aided Design

1993 ◽  
Author(s):  
J. P. Letellier ◽  
John Hines ◽  
Barry Periman ◽  
James Dayton ◽  
Nicholas Naclerio ◽  
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Computer Aided Design ◽  
Computer Aided ◽  
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FY98 Research Technology Area Plan

1998 ◽  
Author(s):  
WRIGHT LAB WRIGHT-PATTERSON AFB OH
Keyword(s):  
Research Technology ◽  
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FY98 Human Systems Technology Area Plan

1998 ◽  
Author(s):  
WRIGHT LAB WRIGHT-PATTERSON AFB OH
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Human Systems

scholarly journals Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

2001 ◽  
Vol 2 (4) ◽  
pp. 34-38 ◽  
Author(s):  
Duck-Jung Lee ◽  
Yun-Hi Lee ◽  
Gwon-Jin Moon ◽  
Jun-Dong Kim ◽  
Won-Do Choi ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Packaging Technology ◽  
Joint Method
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