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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Mapping Intimacies
◽
10.1007/978-1-4615-0231-9
◽
2003
◽
Cited By ~ 11
Keyword(s):
Packaging Technology
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Cited By
References
MEMS Wafer-level Packaging Technology Using LTCC Wafer
IEEJ Transactions on Sensors and Micromachines
◽
10.1541/ieejsmas.132.246
◽
2012
◽
Vol 132
(8)
◽
pp. 246-253
◽
Cited By ~ 1
Author(s):
Mamoru Mohri
◽
Masayoshi Esashi
◽
Shuji Tanaka
Keyword(s):
Wafer Level
◽
Packaging Technology
◽
Wafer Level Packaging
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Development of Silicon Wafer Packaging Technology for Deep UV LED
IEEJ Transactions on Sensors and Micromachines
◽
10.1541/ieejsmas.140.152
◽
2020
◽
Vol 140
(7)
◽
pp. 152-157
Author(s):
Hirofumi Chiba
◽
Yukio Suzuki
◽
Yoshiaki Yasuda
◽
Mitsuyasu Kumagai
◽
Takaaki Koyama
◽
...
Keyword(s):
Silicon Wafer
◽
Packaging Technology
◽
Uv Led
◽
Deep Uv
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Special Technology Area Review on Microwave Packaging Technology
10.21236/ada261852
◽
1993
◽
Author(s):
Becky Terry
Keyword(s):
Packaging Technology
◽
Technology Area
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Advances in Graphic Communication, Printing and Packaging Technology and Materials
10.1007/978-981-16-0503-1
◽
2021
◽
Keyword(s):
Packaging Technology
◽
Graphic Communication
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Vacuum Packaging Technology of AC-PDP using Direct-Joint Method
Journal of Information Display
◽
10.1080/15980316.2018.12035734
◽
2001
◽
Vol 2
(4)
◽
pp. 34-38
◽
Cited By ~ 1
Author(s):
Duck-Jung Lee
◽
Yun-Hi Lee
◽
Gwon-Jin Moon
◽
Jun-Dong Kim
◽
Won-Do Choi
◽
...
Keyword(s):
Vacuum Packaging
◽
Packaging Technology
◽
Joint Method
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Nanocellulose‐Based Multidimensional Structures for Food Packaging Technology
Sustainable Food Packaging Technology
◽
10.1002/9783527820078.ch11
◽
2021
◽
pp. 305-321
Author(s):
Saumya Chaturvedi
◽
Sadaf Afrin
◽
Mohd S. Ansari
◽
Zoheb Karim
Keyword(s):
Food Packaging
◽
Packaging Technology
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A new premolded packaging technology for low cost E/O device applications
1997 Proceedings 47th Electronic Components and Technology Conference
◽
10.1109/ectc.1997.606126
◽
2002
◽
Cited By ~ 1
Author(s):
N. Takehashi
◽
M. Horii
Keyword(s):
Low Cost
◽
Packaging Technology
◽
Device Applications
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3D packaging technology overview and mass memory applications
1996 IEEE Aerospace Applications Conference. Proceedings
◽
10.1109/aero.1996.495988
◽
2002
◽
Cited By ~ 4
Author(s):
R. Terrill
◽
G.L. Beene
Keyword(s):
Packaging Technology
◽
3D Packaging
◽
Memory Applications
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Suspended high Q integrated inductor by wafer level packaging technology
Microsystem Technologies
◽
10.1007/s00542-013-2010-x
◽
2013
◽
Vol 21
(1)
◽
pp. 215-219
◽
Cited By ~ 2
Author(s):
M. Han
◽
S. F. Wang
◽
G. W. Xu
◽
Le Luo
Keyword(s):
Wafer Level
◽
Packaging Technology
◽
High Q
◽
Integrated Inductor
◽
Wafer Level Packaging
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Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution
2010 International Conference on Body Sensor Networks
◽
10.1109/bsn.2010.56
◽
2010
◽
Cited By ~ 9
Author(s):
Torsten Linz
◽
Malte von Krshiwoblozki
◽
Hans Walter
Keyword(s):
Sensor Networks
◽
Adhesive Bonding
◽
High Reliability
◽
Low Cost
◽
Body Sensor Networks
◽
Packaging Technology
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