AbstractIn developing an adhesion test for a microelectronics fabrication facility there are many criteria which must be met. Some of these include (i) sample prep must be simple, (ii) deformations should be elastic so the problem can be easily modeled, (iii) mechanics are ideally analytical, and (iv) the test end-point must be unambiguous and easy to obtain. A testing method in the literature which meets many of these criteria is the modified edge liftoff test (MELT). Delamination is induced through the release of strain energy stored in an elastic superlayer which results from a large mismatch in CTE between the film and substrate. In this work we consider details of the energy release rate calculation, effects of plate bending, and initial flaw size.
STEADY STATE FLAMMABLE GAS RELEASE RATE CALCULATION & LOWER FLAMMABILITY LEVEL EVALUATION FOR HANFORD TANK WASTE