An Approximation of Three-Dimensional Semiconductor Devices by Mixed Finite Element Method and Characteristics-Mixed Finite Element Method

2015 ◽  
Vol 8 (3) ◽  
pp. 356-382 ◽  
Author(s):  
Qing Yang ◽  
Yirang Yuan

AbstractThe mathematical model for semiconductor devices in three space dimensions are numerically discretized. The system consists of three quasi-linear partial differential equations about three physical variables: the electrostatic potential, the electron concentration and the hole concentration. We use standard mixed finite element method to approximate the elliptic electrostatic potential equation. For the two convection-dominated concentration equations, a characteristics-mixed finite element method is presented. The scheme is locally conservative. The optimalL2-norm error estimates are derived by the aid of a post-processing step. Finally, numerical experiments are presented to validate the theoretical analysis.

2000 ◽  
Author(s):  
Sangwook Sihn ◽  
Ajit K. Roy

Abstract A numerical model for three-dimensional stress analysis, which was formulated in the form of mixed finite element method based on Reissner’s mixed variational principle, is applied to analyze stiffness and strength of woven fabric composites. The model calculates three-dimensional effective elastic moduli and predicts failure strengths and damage modes. The failure analysis includes residual stress calculation to consider hygrothermal effect. The numerical calculations show a good agreement with existing experimental and numerical results on both flat and woven laminated composites with various yarn-waviness ratios.


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