This paper presents an advanced method in materials characterization for the mold compound material in semiconductor packages to build models that can technically explain the actual warpage or stress observations under different thermal conditions and time history. In the study, the mold compound material characterization was conducted using Dynamic Mechanical Analyzer (DMA) followed by curve fitting to obtain parameters for the computer modeling input requirement. Thermo-mechanical modeling using viscoelastic material properties was conducted on a bi-material test sample model. Results showed that the new characterized viscoelastic material properties exhibited dependence on time and temperature. Slow cool down from post mold cure (PMC) to room temperature resulted in lower warpage or stress. This observed rate dependent response was explained using viscoelastic material properties in contrast to the usual linear elastic material simplification. Thus, a realistic result from stress or warpage analysis could be achieved using viscoelastic material characterization.
Viscoelastic Material Characterization: A Realistic Approach to Stress Analysis
