Improvements in FOMs and Thermal Effects of a III-V Compound Material Based Short- Channel Thin Film Junctionless Double Gate MOSFETs

Better figure of merits (FOMs) have been achieved by using III-V compound material based junctionless double gate metal-oxide semiconductor field-effect transistors (JL DG-MOSFETs), and a thorough analysis of the device's performance over temperature has been performed using a highly N-doped GaAs-based JL DG-MOSFET using III-V compound material GaSb. GaSb, a compound material, is employed as the source material, which is well known for its greater mobility and injection velocity property with GaAs as the channel and drain materials, to obtain more output current and less leakage current due to the development of hetero structure (GaSb-GaAs) at the source-channel interface. The dielectric material HfO2 with a high k value is utilized to reduce the gate tunneling effects of electrons and enhance the control of the gate at the 20 nm channel length. Primary and auxiliary gates are taken to include ipact ionization on drain side for reducing the Subthreshold-swing. Numerous characteristics of a DG JLMOSFET, such as Id, SS, gm, TGF, Ion / Ioff, Cgs, and fT, GFP, TFP, GTFP are explored and compared with a silicon based material. The proposed structure shows an improved results comparing to the earlier model with Id of 117 mA, SS of 15.08 mV/decade, gm of 0.62 A/V, TGF of 38.8 V-1, Ion / Ioff ratio of 1.89 x 10 13, Cgs of 5.86 x 10 -16 F, fT of 2.05 x 10 15 Hz, GTFP of 1.81 x 10 17 Hz/V for the improvement of FOM in RF and DC analysis

Viscoelastic Material Characterization: A Realistic Approach to Stress Analysis

This paper presents an advanced method in materials characterization for the mold compound material in semiconductor packages to build models that can technically explain the actual warpage or stress observations under different thermal conditions and time history. In the study, the mold compound material characterization was conducted using Dynamic Mechanical Analyzer (DMA) followed by curve fitting to obtain parameters for the computer modeling input requirement. Thermo-mechanical modeling using viscoelastic material properties was conducted on a bi-material test sample model. Results showed that the new characterized viscoelastic material properties exhibited dependence on time and temperature. Slow cool down from post mold cure (PMC) to room temperature resulted in lower warpage or stress. This observed rate dependent response was explained using viscoelastic material properties in contrast to the usual linear elastic material simplification. Thus, a realistic result from stress or warpage analysis could be achieved using viscoelastic material characterization.

Study on Photocatalytic Properties of La–Nd/ZnO in UV-vis Region and Possibility of Large-Scale Effluent Treatment Containing Reactive Dyes

Flower-shaped nanometer zinc oxide and its complex incorporating La–Nd have been prepared using hydrothermal method with zinc chloride and urea as raw materials, ethylene glycol as morphology controller. The powdered samples were characterized by scanning electron microscopy, X-ray diffractometry, photocatalytic test with solutions of reactive dyes as indicators. In conclusion, the optimum doping ratios of La/Nd are considered to be 3%/3%. When 3%La–3%Nd/ZnO was served as photocatalyst, considerable degradations of dyes were caused under the ultraviolet and visible light without exception, owing to the expanded excitation wavelength and reduced band gap of ZnO after incorporating. While using the compound material in effluent treatment containing reactive dyes, the decomposition rate of dyes, respectively, reached 99.99% and 80% or more under UV-light and visible irradiation for 60 min, appreciable removal effects of organic pollutants were obtained, testifying 3%La–3%Nd/ZnO to be a splendid UV-Vis catalyst.

Effects of Organic Polymer Compound Material on K+ and Na+ Distribution and Physiological Characteristics of Cotton Under Saline and Alkaline Stresses

Soil salinization and alkalization greatly restrict crop growth and yield. In this study, NaCl (8 g kg−1) and Na2CO3 (8 g kg−1) were used to create saline stress and alkaline stress on cotton in pot cultivation in the field, and organic polymer compound material (OPCM) and stem girdling were applied before cotton sowing and at flowering and boll-forming stage, respectively, aiming to determine the effects of OPCM on K+ and Na+ absorption and transport and physiological characteristics of cotton leaf and root. The results showed that after applying the OPCM, the Na+ content in leaf of cotton under saline stress and alkaline stress were decreased by 7.72 and 6.49%, respectively, the K+/Na+ ratio in leaf were increased by 5.65 and 19.10%, respectively, the Na+ content in root were decreased by 9.57 and 0.53%, respectively, the K+/Na+ ratio in root were increased by 65.77 and 55.84%, respectively, and the transport coefficients of K+ and Na+ from leaf to root were increased by 39.59 and 21.38%, respectively. The activities of superoxide dismutase (SOD), catalase (CAT), and peroxidase (POD), and the relative electrical conductivity (REC) in cotton leaf were significantly increased, while the content of malondialdehyde (MDA) was decreased; but the changes in those in root were not significant. The boll weights were increased by 11.40 and 13.37%, respectively, compared with those for the control. After stem girdling, the application of OPCM still promoted the ion transport of cotton organs; moreover, the CAT activity in root was increased by 25.09% under saline stress, and the SOD activity in leaf and CAT in root were increased by 42.22 and 6.91%, respectively under alkaline stress. Therefore, OPCM can significantly change the transport of K+ and Na+ to maintain the K+ and Na+ homeostasis in leaf and root, and regulate physiological and biochemical indicators to alleviate the stress-induced damage. Besides, the regulation effect of OPCM on saline stress was better than that on alkaline stress.

Effect of Silicon Die Condition on the Breaking Load Performance of a Dam and Fill Semiconductor Package

A semiconductor package has a silicon die on which an integrated circuit (IC) is fabricated. The die is singulated from a single wafer using processes like mechanical sawing or laser grooving. These processes have impact on the final condition of the silicon die after wafer singulation. This paper discusses a study on the effect of the die condition on the breaking load of a package with a dam and fills structure. The encapsulation material of this type of package has lower modulus when compared with the epoxy mold compound material used in most molded packages. The package breaking load was determined using 3-point bend test for two sets of packages. The first set of packages was assembled with silicon die produced using mechanical sawing. The second set was assembled with die produced using laser grooving. Results of the 3-point bend test showed that the breaking load of the package with die from mechanical sawing is higher compared with the package assembled with die from laser grooving. The study revealed that that the silicon die condition has significant effect on the robustness of the final package where the die is used.

Expanded Usage Window of Molding Compound to Reduce Material Wastage in Manufacturing Line

This paper discusses about direct material wastage brought by expiring molding compound particularly for QFN-mr Packages. An Engineering problem solving methodology was used to identify the material, its consumption, cost, the root cause, and solution of the problem. The study aims to solve huge amount of compound material disposed in the manufacturing line. By challenging the current 24hours suppliers thawing time, it is shown that at 16hours thawing time, molding compound already reached the required room temperature (23°C ± 3°C). To maximize the usage window of molding compound, the existing floor life of 24hrs was also reviewed and after experiment, it was found out that it can still be extended to another 24hrs or 48hrs total floor lifetime. Combining the 2 improvements, a total of 56hrs usage window for the molding compound from 24hrs usage window.

“Rey Resin Dispense Pattern” A Solution to Package Voids Defect on Thinner Package Thickness in Compression Mold

This paper will discuss how package voids Mold defect was addressed on thinner Compression mold packages like BGA (Ball Grid Array) and Sensor Devices. Significant action was the application of “Rey Resin Dispense” pattern in compression mold granule compound dispensing was a key action in reducing package voids defect. Using a DMAIC methodology (Define, Measure, Analyze, Improve and Control), a powerful analytical tool that serves as a guide towards the success of eliminating package voids defect. Using this methodology, all Key Process Input Variables (KPIVs) of compression mold and its molding compound material were identified as X’s or potential causes and test its significance to affect Y-response which is the package voids. Funneling of X’s further trimmed to the most possible contributor to package voids. The remaining possible contributor X’s undergo statistical validation which point to granule compound resin dispensing as the main contributor to induce package voids defect. Several actions were tried but failed to zero-out the defect. With the help of brainstorming and imaginative ideas and data gathered on how to improve granule resin dispense of compression mold positive outcome was realized. From the concept of light ray, to naming it as “Rey Resin Dispense” significantly reduce package voids defect in all thin BGA and Sensor devices. This learning was then applied to all existing thin packages and to new packages in compression molding process.

E-Module Development on Hydrocarbon Compounds Material for Class X Agricultural Vocational High School

The research on the development of e-modules on hydrocarbon compound material for agricultural vocational school education units aims to develop e-modules that are in accordance with the demands of the agricultural vocational curriculum. This study used a research and development (R&D) method with the ADDIE development model which only consists of 3 stages, namely analysis, design and development. The object of research was the e-module on the material of hydrocarbon compounds. The research subjects were 3 educators who taught chemistry subjects at the Agricultural Vocational School and 23 Agricultural Vocational Schools students. Data collection was done through validation sheets and response questionnaires. The results showed that the e-module developed was very valid or very feasible to be tested in the field with an overall average percentage value of material validation of 91.69% and an overall average percentage of media validation of 94.13%. Based on the results of the test, the response of educators obtained an average percentage of 85.18% with the very good category and the results of the students' responses obtained an average percentage of 72.72% with the attractive category. Thus it can be concluded that the e-module of hydrocarbon compounds is very good and interesting to be applied in the learning process on a larger scale.