2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

Nordpac 2018 Front cover

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423844 ◽

2018 ◽

Keyword(s):

Front Cover

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Wafer-level Re-Packaging of Commercial Components for Miniaturization and Embedding

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423859 ◽

2018 ◽

Author(s):

Jens Muller ◽

Markus Hulsmann ◽

Nam Gutzeit ◽

Michael Fischer

Keyword(s):

Wafer Level

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Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423850 ◽

2018 ◽

Author(s):

Amos Nkansah ◽

Nan Wang ◽

Lilei Ye ◽

Xitao Wang ◽

Johan Liu

Keyword(s):

Graphene Film ◽

Electronics Cooling ◽

Reliability Study ◽

Heat Spreader ◽

Thermally Conductive

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Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423848 ◽

2018 ◽

Author(s):

Greg Caswell ◽

Natalie Hernandez ◽

Nathan Blattau ◽

Craig Hillman

Keyword(s):

Human Factors ◽

High Reliability

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LTCC Resistors – The Influence of Production Conditions on the Absolute Value and its Reproducibility

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423847 ◽

2018 ◽

Author(s):

Peter Uhlig ◽

Alexandra Serwa ◽

Jens Muller ◽

Nam Gutzeit ◽

Dieter Schwanke ◽

...

Keyword(s):

Absolute Value ◽

The Absolute ◽

Production Conditions

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Contribution to non-destructive inspection of power semiconductor assemblies by stimulating a lateral heat flow

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423846 ◽

2018 ◽

Author(s):

Michael Schaulin ◽

Ulrich Nordmeyer ◽

Martin Oppermann ◽

Thomas Zerna

Keyword(s):

Heat Flow ◽

Power Semiconductor ◽

Non Destructive ◽

Lateral Heat

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Electrical and Thermal Conduction of Isotropic Conductive Adhesive based on Novel Conductive Particles

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423853 ◽

2018 ◽

Author(s):

Helge Kristiansen ◽

Susanne Helland ◽

Erik Kalland ◽

Mohamad Abo Ras ◽

Corinna Grosse

Keyword(s):

Thermal Conduction ◽

Conductive Adhesive ◽

Isotropic Conductive Adhesive ◽

Conductive Particles

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2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423843 ◽

2018 ◽

Keyword(s):

Copyright Notice

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Quality assurance of encapsulation architecture, including subsequent washing process for permanently mounted wearable sensors

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423849 ◽

2018 ◽

Author(s):

Helene Karlsson ◽

Oscar Lidstrom ◽

Hans Gronqvist ◽

Dag Andersson ◽

Jan Wipenmyr ◽

...

Keyword(s):

Quality Assurance ◽

Wearable Sensors ◽

Washing Process

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Screen Printed Conductive Composites with Reduced Graphene Oxide and Silver

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.23919/nordpac.2018.8423856 ◽

2018 ◽

Cited By ~ 1

Author(s):

Man Song ◽

Jie Zhao ◽

Helena Grennberg ◽

Zhi-Bin Zhang

Keyword(s):

Graphene Oxide ◽

Reduced Graphene Oxide ◽

Conductive Composites ◽

Reduced Graphene ◽

Screen Printed

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2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Latest Publications

TOTAL DOCUMENTS

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Published By IEEE

Nordpac 2018 Front cover

Wafer-level Re-Packaging of Commercial Components for Miniaturization and Embedding

Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications

Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics

LTCC Resistors – The Influence of Production Conditions on the Absolute Value and its Reproducibility

Contribution to non-destructive inspection of power semiconductor assemblies by stimulating a lateral heat flow

Electrical and Thermal Conduction of Isotropic Conductive Adhesive based on Novel Conductive Particles

Nordpac 2018 Copyright Notice

Quality assurance of encapsulation architecture, including subsequent washing process for permanently mounted wearable sensors

Screen Printed Conductive Composites with Reduced Graphene Oxide and Silver

Export Citation Format

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Nordpac 2018 Front cover

Wafer-level Re-Packaging of Commercial Components for Miniaturization and Embedding

Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications

Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics

LTCC Resistors – The Influence of Production Conditions on the Absolute Value and its Reproducibility

Contribution to non-destructive inspection of power semiconductor assemblies by stimulating a lateral heat flow

Electrical and Thermal Conduction of Isotropic Conductive Adhesive based on Novel Conductive Particles

Nordpac 2018 Copyright Notice

Quality assurance of encapsulation architecture, including subsequent washing process for permanently mounted wearable sensors

Screen Printed Conductive Composites with Reduced Graphene Oxide and Silver

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Latest Publications