Handbook of 3D Integration
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Published By Wiley-VCH Verlag Gmbh & Co. Kgaa

9783527670109, 9783527334667
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thinning, Via Reveal, and Backside Processing - Overview

2014 ◽  
pp. 191-206 ◽  
Author(s):  
Eric Beyne ◽  
Anne Jourdain ◽  
Alain Phommahaxay

3D IC Integration Since 2008

2014 ◽  
pp. 1-12 ◽  
Author(s):  
Philip Garrou ◽  
Peter Ramm ◽  
Mitsumasa Koyanagi
Keyword(s):  
3D Ic

Via Reveal and Backside Processing

2014 ◽  
pp. 227-240
Author(s):  
Mitsumasa Koyanagi ◽  
Tetsu Tanaka

Challenges in 3D Fabrication

2014 ◽  
pp. 345-364
Author(s):  
Douglas C.H. Yu
Keyword(s):  
3D Fabrication

Metrology Needs for 2.5D/3D Interconnects

2014 ◽  
pp. 393-430
Author(s):  
Victor H. Vartanian ◽  
Richard A. Allen ◽  
Larry Smith ◽  
Klaus Hummler ◽  
Steve Olson ◽  
...  

Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers

2014 ◽  
pp. 207-226
Author(s):  
Christof Landesberger ◽  
Christoph Paschke ◽  
Hans-Peter Spöhrle ◽  
Karlheinz Bock
Keyword(s):  
Stress Relief ◽  
Silicon Wafers ◽  
Thin Silicon

Laser-Assisted Wafer Processing: New Perspectives in Through-Substrate Via Drilling and Redistribution Layer Deposition

2014 ◽  
pp. 121-134
Author(s):  
Marc B. Hoppenbrouwers ◽  
Gerrit Oosterhuis ◽  
Guido Knippels ◽  
Fred Roozeboom
Keyword(s):  
Layer Deposition ◽  
Wafer Processing
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