Defining an Optimized Machine Process Sequence to Address Broken Wafer Phenomenon on Semiconductor Products

Silicon wafer as a direct material is one of the vital parts of a semiconductor product. Wastages on manufacturing plants that pulls the yield down should be addressed innovatively and accurately. This paper focused on the phenomenon of broken wafers at wafer taping process during wafer preparation. Using a wafer taper machine, silicon wafers are covered by an industrial tape as preparation for the next process. During processing and wafers are placed on wafer boat, unexpected phenomenon of broken wafers due to unwanted falling was encountered. Findings was due to the unintentional dragging of the machine’s robot arm after wafer processing. The problem is resolved through simulation and experiments using statistical analysis. As a result, an optimized machine parameter setting was defined to eliminate the said rejection. Statistical analysis was of a big help in resolving the said phenomenon and improved the process yield of the manufacturing.

Laser DAF Cut: A Breakthrough Approach of Die Attach Film Singulation for Thin Wafers

Today, semiconductor world is becoming more inclined to thinner Integrated Circuit (IC) packages. IC packages will require thinning of the internal configuration of the package, which involves the die or the wafer and the adhesive material, which is the Die Attach Film (DAF). Aligned to this, as wafers goes thinner it becomes more of a challenge in process development especially during its preparatory stages, such as wafer back grinding and sawing processes. As the die becomes smaller and thinner wafer sawing process should have minimum effect on the mechanical integrity of the silicon so as not to alter its quality. New technologies were introduced so as to adopt to this development trend, one of this is the Dicing Before Grinding (DBG). Compared to the normal wafer preparation process that is wafer back grinding before wafer sawing, DBG flow is wafer sawing first prior wafer back grinding processes. The application of DBG technology eliminates the mechanical draw backs of the conventional wafer sawing process. In addition, with the use of DAF for thinner packages, DBG was developed together with the Die Attach Film (DAF) cutting solution, which is Laser DAF Cutting. DAF are separated using Laser as a cutting medium to address potential processability problems that may occur on the conventional mechanical blade saw. The paper discuss the Laser DAF cut development that covers the Design of Experiments (DoE) to understand the different characteristics of Laser DAF solution and be validated through actual simulation and wafer processing. The paper will also cover the interaction of different DAF thicknesses and Laser DAF parameters in order to define the critical characteristics so as to understand the behavior of different laser DAF parameters in achieving optimal DAF cutting process responses.

Wafer Level Packaging Technology Applied to Pixel Detectors

Pixel technology is commonly used in the tracking systems of High Energy Physics detectors with physical areas that have largely increased in the last decades. To ease the production of several square meters of sensitive area, the possibility of using the industrial Wafer Level Packaging to reassemble good single sensor tiles from multiple wafers into a reconstructed full wafer is investigated. This process reconstructs wafers by compression molding using silicon charged epoxy resin. We tested high glass transition temperature low-stress epoxy resins filled with silica particles to best match the thermal expansion of the silicon die. These resins are developed and characterized for industrial processes, designed specifically for fan-out wafer-level package and panel-level packaging. In order to be compatible with wafer processing during the hybridization of the pixel detectors, such as the bump-bonding, the reconstructed wafer must respect challenging technical requirements. Wafer planarity, tile positioning accuracy, and overall thickness are amongst the main ones. In this paper the description of the process is given and preliminary results on a few reconstructed wafers using dummy tiles are reported. Strategies for Wafer Level Packaging improvements are discussed together with future applications to 3D sensors or CMOS pixel detectors.

Processing Technology of Feed Wafer to Increase Feed Production and Efficiency

Feed is one of the important factor that affect livestock productivity, so the availability of good quality feed is a requirement for livestock development in an area. In the tropical area, providing forage as a crucial feed for ruminants was hampered by fluctuating seasons. Likewise, the availability of agricultural waste as an alternative source of feed material experiences the same constraints, easily damaged, and bulky (voluminous). Therefore, feed processing technology is needed so that it is become durable, easily stored, and easily provided for livestock. One way to overcome this is to utilize technology for making wafers. Information regarding technology for making animal feed wafers in Indonesia is still limited. This paper reviews a number of studies that discuss the development of wafer processing technology, types of wafers, the main components of wafer compilers, wafer manufacturing processes, reactions that occur during wafer manufacturing, nutrient quality of various wafers, and the results of research on the use of wafers for feed livestock. Wafers are feeds that are processed using heat and pressure, so that a solid, compact, and high density product is formed. Feed wafer technology is a modification of cube and block feed. Wafers are divided into feed wafers, feed supplement wafers, and complete feed wafers. Feed wafers can be used instead of concentrates. Feed supplement wafers are high in energy and protein. Complete feed wafers contain energy, protein, fiber, and complete minerals that have been adapted to the daily nutritional needs of livestock. Feed wafer processing technology can be one of the strategies to provide feed with a constant composition of nutrients throughout the season and increase production and feed efficiency.

Laser DAF Cut Augmentation for Thin Wafers

The semiconductor industry is becoming more inclined to thinner integrated circuit (IC) packages. Thinner packages with thin wafer or die prefer the die attach film (DAF) technology as the die adhesive material solution. As the wafer goes thinner, it becomes more of a challenge in process development, especially during its assembly preparatory stages. As the dies become smaller and thinner, wafer sawing process should have minimum effect on the mechanical integrity of the silicon so as not to alter its quality. New technologies were developed and introduced in the industry and one of this is the laser die attach film (DAF) cutting. The method was developed together with dies before grinding (DBG) as a cutting medium to address potential processability problems that may occur on the conventional mechanical blade saw. This paper discusses the laser DAF cut development covering the design of experiments (DOE) to understand the different characteristics of laser DAF solution. Validations are made through actual simulation and wafer processing. The paper also covers the interaction of different DAF thicknesses and parameters in order to define the critical characteristics in achieving optimal DAF cutting process responses.