2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)
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A study on an abnormal oxidation issue of copper bonding wire

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Author(s):  
Lois Liao Jinzhi ◽  
Song Jianbo ◽  
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Chen Yan ◽  
Cho Nan ◽  
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Bonding Wire

In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System

2019 ◽  
Author(s):  
S Sharang ◽  
Jiri Dluhos ◽  
Dominika Kalasova ◽  
Andrey Denisyuk ◽  
Rostislav Vana ◽  
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Micro Ct ◽  
Depth Analysis

Leakage Current Degradation in SiC Junction Barrier Schottky Diodes under Heavy Ion Microbeam

2019 ◽  
Author(s):  
Cao Shuang ◽  
Yu Qingkui ◽  
Du Guanghua ◽  
Guo Jinlong ◽  
Wang He ◽  
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Leakage Current ◽  
Schottky Diodes ◽  
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Endpoint Detection Methods in Implementing AI-assisted Polishing Process

2019 ◽  
Author(s):  
Hao TAN ◽  
Jacobus LEO ◽  
Shreyas M PARAB ◽  
Krishnanunni MENON ◽  
Yuzhe ZHAO ◽  
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Detection Methods ◽  
Endpoint Detection ◽  
Polishing Process
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