Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials
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0780326512

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Interfacial properties of a Si-SiO/sub 2/-Si structure fabricated by a modified silicon direct bonding technique

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.617600 ◽

2002 ◽

Author(s):

E.D. Kim ◽

S.C. Kim ◽

J.M. Park ◽

W.G. Min ◽

I.V. Grekhov ◽

...

Keyword(s):

Interfacial Properties ◽

Bonding Technique

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Research overview and application trend in ferroelectric thin films

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.616611 ◽

2002 ◽

Author(s):

Ho-Gi Kim

Keyword(s):

Ferroelectric Thin Films

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Space-charge characteristics in polyethylene for DC power cable

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.617637 ◽

2002 ◽

Author(s):

D. Muto ◽

Y. Suzuoki ◽

T. Mizutani ◽

T. Itaya

Keyword(s):

Space Charge ◽

Power Cable ◽

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Recent developments on Weibull statistics

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.616607 ◽

2002 ◽

Author(s):

R. Ross

Keyword(s):

Weibull Statistics ◽

Recent Developments

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Open-circuit voltage and short-circuit current characteristics of moisture absorbed polyimide thin films with different electrode materials

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.616558 ◽

2002 ◽

Author(s):

Y. Muramoto ◽

M. Nagao ◽

M. Kosaki

Keyword(s):

Electrode Materials ◽

Open Circuit Voltage ◽

Short Circuit ◽

Short Circuit Current ◽

Open Circuit ◽

Current Characteristics

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The properties of thermally stimulated currents in epoxy composites degraded with electrical stress

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.616564 ◽

2002 ◽

Author(s):

G.H. Park ◽

I.H. Jung ◽

K.J. Kim ◽

J.U. Lee

Keyword(s):

Epoxy Composites ◽

Thermally Stimulated Currents ◽

Electrical Stress

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Tendency of R&D on dielectric and electrical insulation materials at university laboratories in Korea

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.617519 ◽

2002 ◽

Author(s):

Joon-Ung Lee

Keyword(s):

Electrical Insulation ◽

Insulation Materials ◽

Electrical Insulation Materials

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Recent trends in Germany of diagnostics for XLPE cable and GIS

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.617525 ◽

2002 ◽

Author(s):

U. Schichler

Keyword(s):

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R&D on insulation diagnosis technology in P.R. China

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.617523 ◽

2002 ◽

Author(s):

H.J. Li ◽

W.S. Gao ◽

Z. Yan

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Observation of polyamic acid alkylamine salts (PAAS) Langmuir/Langmuir-Blodgett films using Brewster angle microscopy (BAM)

Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials ◽

10.1109/icpadm.1997.616520 ◽

2002 ◽

Author(s):

Seung-Yop Lee ◽

Dou-Yol Kang ◽

Tae Wan Kim

Keyword(s):

Brewster Angle ◽

Brewster Angle Microscopy ◽

Polyamic Acid ◽

Langmuir Blodgett ◽

Langmuir Blodgett Films

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