Advances in Chemical Mechanical Planarization (CMP)
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9780081001653

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10.1016/b978-0-08-100165-3.09001-x ◽

2016 ◽

pp. ii

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Chemical metrology methods for CMP quality

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.00012-7 ◽

2016 ◽

pp. 299-325 ◽

Cited By ~ 9

Author(s):

K. Pate ◽

P. Safier

Keyword(s):

Chemical Metrology

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Applications of chemical mechanical planarization (CMP) to More than Moore devices

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.00018-8 ◽

2016 ◽

pp. 463-485 ◽

Cited By ~ 1

Author(s):

G. Zwicker

Keyword(s):

Chemical Mechanical Planarization

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Environmental aspects of planarization processes

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.00010-3 ◽

2016 ◽

pp. 229-269 ◽

Cited By ~ 2

Author(s):

D.E. Speed

Keyword(s):

Environmental Aspects

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Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.00016-4 ◽

2016 ◽

pp. 417-432

Author(s):

M. Tsujimura

Keyword(s):

Chemical Mechanical Polishing ◽

Removal Rate ◽

Mechanical Polishing

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List of contributors

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.01002-0 ◽

2016 ◽

pp. xi-xii

Author(s):

H. Aida ◽

E.A. Baisie ◽

D. Boning ◽

L. Borucki ◽

W. Fan ◽

...

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Approaches to defect characterization, mitigation, and reduction

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.00017-6 ◽

2016 ◽

pp. 433-462 ◽

Cited By ~ 3

Author(s):

W.-T. Tseng

Keyword(s):

Defect Characterization

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Front Matter

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.01001-9 ◽

2016 ◽

pp. iii

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Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.00014-0 ◽

2016 ◽

pp. 359-396 ◽

Cited By ~ 1

Author(s):

U. Künzelmann ◽

H. Schumacher

Keyword(s):

Ftir Spectroscopy ◽

Surface Processes ◽

In Situ Ftir ◽

In Situ Ftir Spectroscopy

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CMP processing of high mobility channel materials

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.00005-x ◽

2016 ◽

pp. 119-135 ◽

Cited By ~ 5

Author(s):

P. Ong ◽

L. Teugels

Keyword(s):

High Mobility ◽

High Mobility Channel

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Advances in Chemical Mechanical Planarization (CMP)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Elsevier

Related titles

Chemical metrology methods for CMP quality

Applications of chemical mechanical planarization (CMP) to More than Moore devices

Environmental aspects of planarization processes

Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters

List of contributors

Approaches to defect characterization, mitigation, and reduction

Front Matter

Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy

CMP processing of high mobility channel materials

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Advances in Chemical Mechanical Planarization (CMP)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Elsevier

Related titles

Chemical metrology methods for CMP quality

Applications of chemical mechanical planarization (CMP) to More than Moore devices

Environmental aspects of planarization processes

Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters

List of contributors

Approaches to defect characterization, mitigation, and reduction

Front Matter

Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy

CMP processing of high mobility channel materials

Advances in Chemical Mechanical Planarization (CMP)
Latest Publications