IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780379330

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Reliability ground rules change at >50 μm pitch

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225875 ◽

2004 ◽

Cited By ~ 1

Author(s):

I. Singh ◽

L. Levine ◽

J. Brunner

Equipment failure definition: a prerequisite for reliability test and validation

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225929 ◽

2004 ◽

Cited By ~ 3

Author(s):

A. Fashandi ◽

T. Umberg

Keyword(s):

Reliability Test ◽

Equipment Failure

3D stacked packages with bumpless interconnect technology

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225906 ◽

2004 ◽

Cited By ~ 4

Author(s):

C.W.C. Lin ◽

S.C.L. Chiang ◽

T.K.A. Yang

Keyword(s):

Interconnect Technology

Reducing the cost of package Test

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225905 ◽

2004 ◽

Author(s):

S.R. Shakeri

Keyword(s):

The Cost

Processing and reliability of corner bonded CSPs

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225917 ◽

2004 ◽

Cited By ~ 11

Author(s):

B.J. Toleno ◽

J. Schneider

Towards a halogen-free package - green molding compound

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225886 ◽

2004 ◽

Cited By ~ 3

Author(s):

J.B.N. Kee ◽

J.T.S. Yip

Keyword(s):

Molding Compound ◽

Halogen Free

Package stacking in SMT for 3D PCB assembly

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225911 ◽

2004 ◽

Cited By ~ 11

Author(s):

D. Geiger ◽

D. Shangguan ◽

S. Tam ◽

D. Rooney

Keyword(s):

Pcb Assembly

Modeling and simulation of 12.5 Gb/s on a HyperBGA/sup /spl reg// package

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225891 ◽

2004 ◽

Cited By ~ 7

Author(s):

R.D. McBride ◽

S.G. Rosser ◽

R.P. Nowak

Keyword(s):

Modeling And Simulation

The impact of moisture in mold compound preforms on the warpage of PBGA packages

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225913 ◽

2004 ◽

Cited By ~ 4

Author(s):

T.Y. Lin ◽

B. Njoman ◽

D. Crouthamel ◽

K.H. Chua ◽

S.Y. Teo

Keyword(s):

The Impact

Highly reliable photoimageable dielectric resins for wafer level CSP redistribution

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225894 ◽

2004 ◽

Cited By ~ 1

Author(s):

C. Esposito ◽

E. Yamayoshi ◽

M. Yonehara ◽

K. Arao ◽

K. Yoshida ◽

...

Keyword(s):

Wafer Level

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Reliability ground rules change at >50 μm pitch

Equipment failure definition: a prerequisite for reliability test and validation

3D stacked packages with bumpless interconnect technology

Reducing the cost of package Test

Processing and reliability of corner bonded CSPs

Towards a halogen-free package - green molding compound

Package stacking in SMT for 3D PCB assembly

Modeling and simulation of 12.5 Gb/s on a HyperBGA/sup /spl reg// package

The impact of moisture in mold compound preforms on the warpage of PBGA packages

Highly reliable photoimageable dielectric resins for wafer level CSP redistribution

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.
Latest Publications