Exploration of a new affordable thermal protection system utilizing 2.5D silica/polysiloxane composite

Ablative materials are used as thermal protection systems (TPS) for reentry vehicles and solid rocket motor (SRM) nozzle applications. Phenolic and cyanate ester are the state-of-the-art (SOTA) resin systems used in many of the ablative composites today, including MX-2600 (silica/phenolic) from Cytec Solvay Group. While these ablatives have worked well, more demanding requirements drive the need for affordable lightweight advanced composites capable of handling high heat fluxes with minimal mass loss. These advanced ablative composites result in lighter reentry heat shields and solid rocket motors, increasing payload capabilities of spacecraft and rockets. Molding compound made of aerospace grade 99% SiO2 fabric and polysiloxane resin showed considerable improvement over MX-2600 in ablation properties in recent studies. In order to meet increased mechanical strength demands, NASA recently developed an ablative composite using a 3D quartz woven/cyanate ester composite material designed for the Orion spacecraft. While 3D woven composites provide excellent out-of-plane mechanical and ablation properties, they are very expensive, which limits their application. This research explores needle-punched silica fabric, sometimes referred to as 2.5D, which provides similar out-of-plane mechanical benefits to 3D woven composites in a more flexible VARTM manufacturing process at a much lower cost. The needle-punched silica fabric was infiltrated with polysiloxane resin and mechanical tests were performed. The needle-punched composites showed an increase of 181% in flexural strength, 27% in interlaminar shear strength, 2% in tensile strength, and 13% in compressive strength. In aerothermal ablation tests, the 2.5D out-performed the 2D laminate in char yield, mass loss, and recession rate; and in char yield and mass loss (%), the 2.5D out-performed the industry standard MX-2600 molding compound. The increased out-of-plane strength and char yield make it a promising and affordable ablative candidate for ablation performance with enhanced mechanical properties.

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Much of the electronics used to support power systems and enable safety systems resides underhood where operating temperatures are much higher than in traditional consumer applications. Underhood electronics may be subjected to sustained high temperature environment 150°C for long period of time during operation. However, there is insufficient information about the viscoelasticity of epoxy molding compound stored in sustained high temperature for long period of time. In this paper, two different types of epoxy molding compounds have been prepared and aged under two different temperatures: 100°C and 150°C. Multi-frequency scan dynamic mechanical analyzer (DMA) test has been conducted to study the viscoelasticity evolution from pristine, 40 days, 80 days, 120 days. The master curve has been obtained and the prony parameters of EMCs have been calculated. The aging effect of linear viscoelasticity has been discussed.

Effect of High Temperature Storage on AC Characteristics of Polymer Tantalum Capacitors

Replacement of MnO2 with conductive polymers as cathode materials in chip tantalum capacitors allows for a substantial reduction of the equivalent series resistance (ESR), improvement of frequency characteristics, and elimination of the possibility of ignition during failures. One of the drawbacks of chip polymer tantalum capacitors (CPTCs) is a relatively poor long-term stability at high temperatures. In this work, variations of capacitance, dissipation factor, and ESR in different types of capacitors including automotive grade parts from three manufacturers have been monitored during storage at temperatures from 100°C to 175°C for up to 18,000 h. Results show that ESR is the most and capacitance the least sensitive to degradation parameter. Times to parametric failures have been simulated using a Weibull-Arrhenius model that allowed for assessments of activation energies of the degradation and prediction of times to failure at the use temperature. Degradation of CPTCs was explained by thermo-oxidative processes in conductive polymers that result in exponential increasing of the resistivity with time of ageing. This process starts after a certain incubation period that depends on packaging materials and design and corresponds to the time that is necessary to form delamination between the encapsulating molding compound and lead frame. The effectiveness of the existing qualification procedures to assure stable operation of CPTCs is discussed.