Electroless Copper and Nickel–Phosphorus Plating
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Published By Elsevier

9781845698089

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Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.backmatter ◽

2011 ◽

pp. 275-285

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Crystallisation of nickel–phosphorus (Ni–P) deposits with medium and low phosphorus content

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.2.163 ◽

2011 ◽

pp. 163-182

Author(s):

W. Sha ◽

X. Wu ◽

K.G. Keong

Keyword(s):

Phosphorus Content ◽

Low Phosphorus

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Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.1.82 ◽

2011 ◽

pp. 82-103

Author(s):

W. Sha ◽

X. Wu ◽

K.G. Keong

Keyword(s):

Molecular Dynamics ◽

Md Simulation ◽

Copper Deposits ◽

Pyramid Structure ◽

Electroless Copper ◽

Diamond Pyramid

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Applications of electroless copper deposits

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.1.135 ◽

2011 ◽

pp. 135-138

Author(s):

W. Sha ◽

X. Wu ◽

K.G. Keong

Keyword(s):

Copper Deposits ◽

Electroless Copper

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The atomic model of the diamond pyramid structure in electroless copper deposits

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.1.62 ◽

2011 ◽

pp. 62-81

Author(s):

W. Sha ◽

X. Wu ◽

K.G. Keong

Keyword(s):

Atomic Model ◽

Copper Deposits ◽

Pyramid Structure ◽

Electroless Copper ◽

Diamond Pyramid

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Adhesion strength of electroless copper deposit to epoxy board

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.1.104 ◽

2011 ◽

pp. 104-116

Author(s):

W. Sha ◽

X. Wu ◽

K.G. Keong

Keyword(s):

Adhesion Strength ◽

Copper Deposit ◽

Electroless Copper

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Applications of electroless nickel–phosphorus (Ni–P) plating

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.2.263 ◽

2011 ◽

pp. 263-274

Author(s):

W. Sha ◽

X. Wu ◽

K.G. Keong

Keyword(s):

Electroless Nickel

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Artificial neural network (ANN) modelling of crystallisation temperatures of nickel–phosphorus deposits

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.2.218 ◽

2011 ◽

pp. 218-243

Author(s):

W. Sha ◽

X. Wu ◽

K.G. Keong

Keyword(s):

Neural Network ◽

Artificial Neural Network ◽

Artificial Neural ◽

Artificial Neural Network Ann

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Author contact details

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1016/b978-1-84569-808-9.50018-9 ◽

2011 ◽

pp. xi

Author(s):

Wei Sha ◽

Xiaomin Wu ◽

Kim Ghee Keong

Keyword(s):

Author Contact

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Crystallisation of nickel–phosphorus (Ni–P) deposits with high phosphorus content

Electroless Copper and Nickel–Phosphorus Plating ◽

10.1533/9780857090966.2.141 ◽

2011 ◽

pp. 141-162 ◽

Cited By ~ 2

Author(s):

W. Sha ◽

X. Wu ◽

K.G. Keong

Keyword(s):

Phosphorus Content ◽

High Phosphorus ◽

High Phosphorus Content

Download Full-text

Electroless Copper and Nickel–Phosphorus PlatingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Elsevier

Index

Crystallisation of nickel–phosphorus (Ni–P) deposits with medium and low phosphorus content

Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits

Applications of electroless copper deposits

The atomic model of the diamond pyramid structure in electroless copper deposits

Adhesion strength of electroless copper deposit to epoxy board

Applications of electroless nickel–phosphorus (Ni–P) plating

Artificial neural network (ANN) modelling of crystallisation temperatures of nickel–phosphorus deposits

Author contact details

Crystallisation of nickel–phosphorus (Ni–P) deposits with high phosphorus content

Electroless Copper and Nickel–Phosphorus Plating
Latest Publications