Semiconductor Advanced Packaging
Latest Publications

TOTAL DOCUMENTS

11

(FIVE YEARS 11)

H-INDEX

0

(FIVE YEARS 0)

Published By Springer Singapore

9789811613753, 9789811613760

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

System-in-Package (SiP)

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_2 ◽

2021 ◽

pp. 27-74

Author(s):

John H. Lau

Advanced Packaging

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_1 ◽

2021 ◽

pp. 1-25

Author(s):

John H. Lau

Keyword(s):

Advanced Packaging

Hybrid Bonding

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_8 ◽

2021 ◽

pp. 379-411

Author(s):

John H. Lau

3D IC Integration and 3D IC Packaging

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_7 ◽

2021 ◽

pp. 343-378

Author(s):

John H. Lau

Keyword(s):

3D Ic ◽

3D Ic Packaging ◽

Ic Packaging

Advanced Packaging Trends

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_11 ◽

2021 ◽

pp. 465-489

Author(s):

John H. Lau

Keyword(s):

Advanced Packaging

Fan-Out Wafer/Panel-Level Packaging

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_4 ◽

2021 ◽

pp. 147-237

Author(s):

John H. Lau

Chiplet Heterogeneous Integration

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_9 ◽

2021 ◽

pp. 413-439

Author(s):

John H. Lau

Keyword(s):

Heterogeneous Integration

2.5D IC Integration

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_6 ◽

2021 ◽

pp. 299-342

Author(s):

John H. Lau

2D, 2.1D, and 2.3D IC Integration

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_5 ◽

2021 ◽

pp. 239-298

Author(s):

John H. Lau

Low Loss Dielectric Materials

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_10 ◽

2021 ◽

pp. 441-463

Author(s):

John H. Lau

Keyword(s):

Dielectric Materials ◽

Low Loss