Chiplet Heterogeneous Integration

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_9 ◽

2021 ◽

pp. 413-439

Author(s):

John H. Lau

Keyword(s):

Heterogeneous Integration

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Heterogeneous Integration of Boost Power Supply and On-Chip Solar Cell using triple well CMOS Process

IEEJ Transactions on Electronics Information and Systems ◽

10.1541/ieejeiss.138.41 ◽

2018 ◽

Vol 138 (1) ◽

pp. 41-49

Author(s):

Kazuma Igarashi ◽

Yoshimasa Minami ◽

Nobuhiko Nakano

Keyword(s):

Power Supply ◽

Heterogeneous Integration ◽

Cmos Process ◽

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New Techniques for Heterogeneous Integration for Optical Sensing Systems

10.21236/ada425888 ◽

2003 ◽

Author(s):

Richard M. Osgood ◽

Jr

Keyword(s):

Optical Sensing ◽

Heterogeneous Integration ◽

New Techniques ◽

Sensing Systems

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Coupling schemes for heterogeneous integration of III-V membrane devices and silicon-on-insulator waveguides

Journal of Lightwave Technology ◽

10.1109/jlt.2005.856231 ◽

2005 ◽

Vol 23 (11) ◽

pp. 3827-3831 ◽

Author(s):

G. Roelkens ◽

D. Van Thourhout ◽

R. Baets

Keyword(s):

Silicon On Insulator ◽

Heterogeneous Integration

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Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration

2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ◽

10.1109/edtm50988.2021.9421033 ◽

2021 ◽

Author(s):

Masaya Kawano

Keyword(s):

Heterogeneous Integration ◽

3D Packaging ◽

Technology Trends

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Silicon-Interconnect Fabric for Fine-pitch (≤10 μm) Heterogeneous Integration

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2021.3075219 ◽

2021 ◽

pp. 1-1

Author(s):

Siva Chandra Jangam ◽

Subramanian S. Iyer

Keyword(s):

Heterogeneous Integration ◽

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More-Than-Moore: 3D heterogeneous integration into CMOS technologies

2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) ◽

10.1109/nems.2017.8016961 ◽

2017 ◽

Author(s):

Albert Wang ◽

Qi Chen ◽

Cheng Li ◽

Fei Lu ◽

Chenkun Wang ◽

...

Keyword(s):

Heterogeneous Integration

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Challenges in Placement Requirements for Heterogeneous Integration

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315100 ◽

2020 ◽

Author(s):

Chan Pin Chong

Keyword(s):

Heterogeneous Integration

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Monolithic Heterogeneous Integration of BEOL Power Gating Transistors of Carbon Nanotube Networks with FEOL Si Ring Oscillator Circuits

2019 IEEE International Electron Devices Meeting (IEDM) ◽

10.1109/iedm19573.2019.8993593 ◽

2019 ◽

Author(s):

Chao-Ching Cheng ◽

Lain-Jong Li ◽

H.-S. Philip Wong ◽

Chun-Chieh Lu ◽

Tsu-Ang Chao ◽

...

Keyword(s):

Carbon Nanotube ◽

Ring Oscillator ◽

Heterogeneous Integration ◽

Power Gating ◽

Carbon Nanotube Networks ◽

Oscillator Circuits

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Heterogeneous integration by wafer-to-wafer transfer technology

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.1109/ltb-3d.2014.6886172 ◽

2014 ◽

Author(s):

Shuji Tanaka

Keyword(s):

Heterogeneous Integration

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Heterogeneous integration of epitaxial nanostructures: strategies and application drivers

10.1117/12.970438 ◽

2012 ◽

Author(s):

Chi On Chui ◽

Kyeong-Sik Shin ◽

Jorge Kina ◽

Kun-Huan Shih ◽

Pritish Narayanan ◽

...

Keyword(s):

Heterogeneous Integration

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