2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

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Published By IEEE

9781538647196

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The use of polymer rich colloids to enable high adhesion electroless copper plating on FR4 substrates

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255957 ◽

2017 ◽

Author(s):

Shruti Shaunik ◽

Ting-Yun Hsiao ◽

Cheng-You Hong ◽

Tzu-Chien Wei

Keyword(s):

Copper Plating ◽

Electroless Copper Plating ◽

High Adhesion ◽

Electroless Copper

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Abstract instructions for MIPI C-PHY production feasibility in PCB layout assisted by simulation software

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255937 ◽

2017 ◽

Author(s):

Tung Liang Chiu ◽

Hung Chan Lin ◽

Kuei Heng Lai

Keyword(s):

Simulation Software ◽

Pcb Layout

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Development of consistent interconversions between linear viscoelastic functions for multiaxial viscoelastic models

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255929 ◽

2017 ◽

Author(s):

Dao-Long Chen ◽

Tz-Cheng Chiu ◽

Shu-Hua Lee ◽

Po-Hsien Sung ◽

Meng-Kai Shih ◽

...

Keyword(s):

Viscoelastic Models ◽

Linear Viscoelastic

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Novel solder alloy with wide service temperature capability for automotive applications

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255963 ◽

2017 ◽

Author(s):

Jie Geng ◽

Hongwen Zhang ◽

Francis Mutuku ◽

Ning-Cheng Lee

Keyword(s):

Solder Alloy ◽

Service Temperature ◽

Automotive Applications ◽

Temperature Capability

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Differential impedance controlling of rigid flexible board

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255900 ◽

2017 ◽

Author(s):

Chen-Xi Xie ◽

Yi-Ping Chen ◽

Lu-Shiang Shen

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A new resonance-eliminating EMI conformal shielding with side-wall openings

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255956 ◽

2017 ◽

Cited By ~ 1

Author(s):

Ming-Wen Liao ◽

Albert Lin ◽

Chun-Ying Huang

Keyword(s):

Side Wall ◽

Wall Openings

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Trace-in-bump for flip chip applications

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255916 ◽

2017 ◽

Author(s):

Teck Kheng Lee ◽

Bok Leng Ser ◽

Amit Kumar

Keyword(s):

Flip Chip

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WLAN Rx sensitivity analysis by using non-contact probing measurement

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255954 ◽

2017 ◽

Author(s):

Albert Lin ◽

Noah Chen ◽

Ming-Wen Liao ◽

Yu-Cheng Liu

Keyword(s):

Sensitivity Analysis

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Preparation and characterization of aqueous dispersions based on single-walled carbon nanotubes functionalized with carboxyl anthracenes

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255948 ◽

2017 ◽

Cited By ~ 1

Author(s):

Ting-Jung Tsai ◽

Pen-Cheng Wang

Keyword(s):

Carbon Nanotubes ◽

Single Walled Carbon Nanotubes ◽

Aqueous Dispersions ◽

Single Walled Carbon ◽

Walled Carbon Nanotubes

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Thermal test effect on fan-out wafer level package strength

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255915 ◽

2017 ◽

Cited By ~ 3

Author(s):

Cheng Xu ◽

Z.W. Zhong ◽

W.K. Choi

Keyword(s):

Wafer Level ◽

Thermal Test ◽

Wafer Level Package

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2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

The use of polymer rich colloids to enable high adhesion electroless copper plating on FR4 substrates

Abstract instructions for MIPI C-PHY production feasibility in PCB layout assisted by simulation software

Development of consistent interconversions between linear viscoelastic functions for multiaxial viscoelastic models

Novel solder alloy with wide service temperature capability for automotive applications

Differential impedance controlling of rigid flexible board

A new resonance-eliminating EMI conformal shielding with side-wall openings

Trace-in-bump for flip chip applications

WLAN Rx sensitivity analysis by using non-contact probing measurement

Preparation and characterization of aqueous dispersions based on single-walled carbon nanotubes functionalized with carboxyl anthracenes

Thermal test effect on fan-out wafer level package strength

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications