Proceedings of IEEE Electrical Performance of Electronic Packaging
Latest Publications

TOTAL DOCUMENTS

60

(FIVE YEARS 0)

H-INDEX

7

(FIVE YEARS 0)

Published By IEEE

0780314271

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Role of driver loading conditions on simultaneous switching noise

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394552 ◽

2002 ◽

Author(s):

A. Vaidyanath ◽

B. Thoroddsen ◽

J.L. Prince

Keyword(s):

Switching Noise ◽

Loading Conditions ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

Download Full-text

Crosstalk as an attenuation mechanism in coupled microstrip transmission lines

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394550 ◽

2002 ◽

Author(s):

M.A. Bruns ◽

S.H. Pepper

Keyword(s):

Transmission Lines ◽

Attenuation Mechanism ◽

Microstrip Transmission Lines

Download Full-text

Electrical characterization of packaging environment using switching noise generating vehicle

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394551 ◽

2002 ◽

Author(s):

T. Sudo ◽

M. Miura ◽

N. Hirano ◽

Y. Hiruta

Keyword(s):

Electrical Characterization ◽

Switching Noise

Download Full-text

Electrical packaging requirements for low voltage ICs-3.3 V High Performance CMOS devices as a case study

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394604 ◽

2002 ◽

Author(s):

R. Senthinathan ◽

A. Mehra ◽

M. Mahalingam ◽

Y. Doi ◽

H. Astrain

Keyword(s):

High Performance ◽

Download Full-text

Efficient computation of ground plane inductances and currents

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394572 ◽

2002 ◽

Author(s):

R. Raghuram ◽

D. Divekar ◽

P. Wang

Keyword(s):

Ground Plane ◽

Efficient Computation

Download Full-text

Calculation of multi-port parameters of electronic packages using a general purpose electromagnetics code

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394596 ◽

2002 ◽

Author(s):

B.J. Rubin ◽

S. Daijavad

Keyword(s):

General Purpose ◽

Electronic Packages

Download Full-text

On the extraction of circuit parameters of microstrip elements from MOM-Computed currents

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394592 ◽

2002 ◽

Author(s):

K. Naishadham

Download Full-text

Flip chip interconnect of 2.5-watt CPW power amplifier MMIC

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394598 ◽

2002 ◽

Author(s):

C.K. Pao ◽

W.S. Wong ◽

W.D. Gray ◽

C. Liu ◽

D.C. Wang ◽

...

Keyword(s):

Power Amplifier ◽

Download Full-text

Comparison of driver models for the computer-aided analysis of electronic packages

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394555 ◽

2002 ◽

Author(s):

S.N. Pratapneni ◽

C.M. Wolff ◽

N. Cherukuri ◽

J.L. Prince

Keyword(s):

Electronic Packages ◽

Computer Aided Analysis ◽

Download Full-text

EM analysis of low inductance decoupling capacitors

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394585 ◽

2002 ◽

Author(s):

B. Beker ◽

G. Cokkinides ◽

A. Templeton

Keyword(s):

Decoupling Capacitors

Download Full-text