Electronic Packaging and Interconnects Series - High-Frequency Characterization of Electronic Packaging
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Published By Springer US

9780792383079, 9781461556237

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Measurement-Based Modeling Algorithms

Electronic Packaging and Interconnects Series - High-Frequency Characterization of Electronic Packaging ◽

10.1007/978-1-4615-5623-7_5 ◽

1998 ◽

pp. 97-154

Author(s):

Luc Martens

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Electrical Description of Electronic Packaging

Electronic Packaging and Interconnects Series - High-Frequency Characterization of Electronic Packaging ◽

10.1007/978-1-4615-5623-7_2 ◽

1998 ◽

pp. 7-22

Author(s):

Luc Martens

Keyword(s):

Electronic Packaging

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High-Frequency Measurement Techniques for Electronic Packaging

Electronic Packaging and Interconnects Series - High-Frequency Characterization of Electronic Packaging ◽

10.1007/978-1-4615-5623-7_4 ◽

1998 ◽

pp. 65-96 ◽

Author(s):

Luc Martens

Keyword(s):

Electronic Packaging ◽

High Frequency ◽

Measurement Techniques ◽

Frequency Measurement

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Electronic Packaging and High Frequencies

Electronic Packaging and Interconnects Series - High-Frequency Characterization of Electronic Packaging ◽

10.1007/978-1-4615-5623-7_1 ◽

1998 ◽

pp. 1-6

Author(s):

Luc Martens

Keyword(s):

Electronic Packaging ◽

High Frequencies

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High-Frequency Measurement Techniques

Electronic Packaging and Interconnects Series - High-Frequency Characterization of Electronic Packaging ◽

10.1007/978-1-4615-5623-7_3 ◽

1998 ◽

pp. 23-63

Author(s):

Luc Martens

Keyword(s):

High Frequency ◽

Measurement Techniques ◽

Frequency Measurement

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