IEEE Transactions on Components Packaging and Manufacturing Technology Part A
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Published By Institute Of Electrical And Electronics Engineers

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Inside front cover

1998 ◽  
Vol 21 (4) ◽  
pp. c2-c2 ◽  
Author(s):  
C.T. Dervos ◽  
J.M. Michaelides
Keyword(s):  
Front Cover

An investigation of the contact behavior of electric distributed filament contacts

1998 ◽  
Vol 21 (4) ◽  
pp. 604-609 ◽  
Author(s):  
Jingsong Xie ◽  
Michael G. Pecht ◽  
Joseph A. Swift ◽  
Stanley J. Wallace
Keyword(s):  
Contact Behavior

scholarly journals A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package

1998 ◽  
Vol 21 (4) ◽  
pp. 565-576 ◽  
Author(s):  
Filip Christiaens ◽  
Bart Vandevelde ◽  
Eric Beyne ◽  
Robert Mertens ◽  
Jan Berghmans
Keyword(s):  
Thermal Models

Anodic to cathodic arc transition according to break arc lengthening

1998 ◽  
Vol 21 (4) ◽  
pp. 599-603 ◽  
Author(s):  
N. Ben Jemaa ◽  
L. Morin ◽  
S. Benhenda ◽  
L. Nedelec
Keyword(s):  
Cathodic Arc

Coffin-Manson based fatigue analysis of underfilled DCAs

1998 ◽  
Vol 21 (4) ◽  
pp. 577-584 ◽  
Author(s):  
Vadim Gektin ◽  
Avram Bar-Cohen ◽  
Sorin Witzman
Keyword(s):  
Fatigue Analysis
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