IEEE Transactions on Components and Packaging Technologies
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1502

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Published By Institute Of Electrical And Electronics Engineers

1557-9972, 1521-3331

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IEEE Components, Packaging, and Manufacturing Technology Society information for authors

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2102232 ◽

2010 ◽

Vol 33 (4) ◽

pp. C3-C3

Keyword(s):

Manufacturing Technology

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Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2051034 ◽

2010 ◽

Vol 33 (4) ◽

pp. 728-737 ◽

Cited By ~ 30

Author(s):

Bong-Min Song ◽

Bongtae Han ◽

Avram Bar-Cohen ◽

Rajdeep Sharma ◽

Mehmet Arik

Keyword(s):

Prediction Model ◽

Life Prediction ◽

Life Prediction Model

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Glowing Connection Experiments With Alternating Currents Below 1${\rm A}_{\rm rms}$

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2077737 ◽

2010 ◽

Vol 33 (4) ◽

pp. 777-783

Author(s):

Joe Urbas

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[Front cover]

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2102235 ◽

2010 ◽

Vol 33 (4) ◽

pp. C1-C1

Keyword(s):

Front Cover

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Studies on Optical Consistency of White LEDs Affected by Phosphor Thickness and Concentration Using Optical Simulation

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2044576 ◽

2010 ◽

Vol 33 (4) ◽

pp. 680-687 ◽

Cited By ~ 66

Author(s):

Zong-Yuan Liu ◽

Sheng Liu ◽

Kai Wang ◽

Xiao-Bing Luo

Keyword(s):

Optical Simulation ◽

White Leds

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Multiobjective Optimization of a Grooved Micro-Channel Heat Sink

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2070874 ◽

2010 ◽

Vol 33 (4) ◽

pp. 767-776 ◽

Cited By ~ 24

Author(s):

Danish Ansari ◽

Afzal Husain ◽

Kwang-Yong Kim

Keyword(s):

Multiobjective Optimization ◽

Heat Sink ◽

Micro Channel

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IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2102233 ◽

2010 ◽

Vol 33 (4) ◽

pp. 860-860

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2011 IEEE membership form

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2102234 ◽

2010 ◽

Vol 33 (4) ◽

pp. 856-857

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Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2064313 ◽

2010 ◽

Vol 33 (4) ◽

pp. 801-808 ◽

Cited By ~ 35

Author(s):

Masafumi Kuramot ◽

Satoru Ogawa ◽

Miki Niwa ◽

Keun-Soo Kim ◽

Katsuaki Suganuma

Keyword(s):

Low Temperature ◽

Light Emitting Diode ◽

Low Temperature Sintering ◽

Silver Particles ◽

Light Emitting ◽

Die Bonding ◽

Micrometer Size

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2010 Index IEEE Transactions on Components and Packaging Technologies Vol. 33

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2102971 ◽

2010 ◽

Vol 33 (4) ◽

pp. 840-855

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IEEE Transactions on Components and Packaging Technologies
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Institute Of Electrical And Electronics Engineers

IEEE Components, Packaging, and Manufacturing Technology Society information for authors

Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire

Glowing Connection Experiments With Alternating Currents Below 1${\rm A}_{\rm rms}$

[Front cover]

Studies on Optical Consistency of White LEDs Affected by Phosphor Thickness and Concentration Using Optical Simulation

Multiobjective Optimization of a Grooved Micro-Channel Heat Sink

Table of contents

2011 IEEE membership form

Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles

2010 Index IEEE Transactions on Components and Packaging Technologies Vol. 33

Export Citation Format

IEEE Transactions on Components and Packaging TechnologiesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Institute Of Electrical And Electronics Engineers

IEEE Components, Packaging, and Manufacturing Technology Society information for authors

Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire

Glowing Connection Experiments With Alternating Currents Below 1${\rm A}_{\rm rms}$

[Front cover]

Studies on Optical Consistency of White LEDs Affected by Phosphor Thickness and Concentration Using Optical Simulation

Multiobjective Optimization of a Grooved Micro-Channel Heat Sink

Table of contents

2011 IEEE membership form

Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles

2010 Index IEEE Transactions on Components and Packaging Technologies Vol. 33

IEEE Transactions on Components and Packaging Technologies
Latest Publications