Microelectronic Packaging - New Trends in Electrochemical Technology
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Published By CRC Press

9780415311908, 9780203473689

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Compliant interconnects

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.ch7 ◽

2004 ◽

Author(s):

Paul Kohl

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Processes and equipment for wet etching and cleaning

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.ch17 ◽

2004 ◽

Author(s):

Jeffery Butterbaugh

Keyword(s):

Wet Etching

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Plated through-hole technology for boards

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.ch13 ◽

2004 ◽

Author(s):

Haruo Akahoshi

Keyword(s):

Plated Through Hole ◽

Through Hole

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Front Matter

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.fmatt ◽

2004 ◽

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Chemical ‚Äì mechanical planarization

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.pt5 ◽

2004 ◽

Cited By ~ 1

Author(s):

David Watts ◽

Norio Kimura ◽

Manabu Tsujimura

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Materials overview in organic packaging

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.pt4 ◽

2004 ◽

Author(s):

Saikumar Jayaraman ◽

John Tang ◽

Vijay Wakharkar

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Electrochemical processing technologies and their impact in microelectronic packaging

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.pt1 ◽

2004 ◽

Author(s):

Madhav Datta

Keyword(s):

Microelectronic Packaging ◽

Processing Technologies ◽

Electrochemical Processing

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Pb-free flip-chip technologies

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.ch8 ◽

2004 ◽

Author(s):

Darrel Frear ◽

W Lytle

Keyword(s):

Flip Chip

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Flip-chip interconnection

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.ch6 ◽

2004 ◽

Author(s):

Madhav Datta

Keyword(s):

Flip Chip

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Tape carrier and development trend

Microelectronic Packaging - New Trends in Electrochemical Technology ◽

10.1201/9780203473689.pt3 ◽

2004 ◽

Author(s):

Osamu Yoshioka ◽

Akira Chinda

Keyword(s):

Development Trend

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Microelectronic Packaging - New Trends in Electrochemical TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By CRC Press

Compliant interconnects

Processes and equipment for wet etching and cleaning

Plated through-hole technology for boards

Front Matter

Chemical ‚Äì mechanical planarization

Materials overview in organic packaging

Electrochemical processing technologies and their impact in microelectronic packaging

Pb-free flip-chip technologies

Flip-chip interconnection

Tape carrier and development trend

Microelectronic Packaging - New Trends in Electrochemical Technology
Latest Publications