Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging

In the field of electronics packaging, Pb-bearing solder alloys are mostly used as robust interconnecting materials [...]

The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging

The electronic packaging and systems are very important topics as the limitation of miniaturization approaches in semiconductor industry. Regarding the optimal materials microstructure for these applications, we studied different alloys such as Sn-3.0Ag-0.5Cu (wt.%)/organic solderability preservative (SAC305/OSP) Cu and SAC305–0.05Ni/OSP Cu solder joints. We implemented the fractal dimension characterization and microstructure morphology reconstruction. This is the first time that we applied fractals on such alloys. The morphology reconstruction is important for predicting and designing the optimal microstructure for the advanced desirable properties these alloys. These analyzed parameters are important for the hand-held devices and systems especially for the exploitation. The fractal reconstruction was applied on the prepared microstructures with five different magnifications. The results confirmed successful application of fractals in this area of materials science considering the grains and shapes reconstructions.