2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
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Published By IEEE

9781479986002

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Thermal management in mobile devices: challenges and solutions

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100138 ◽

2015 ◽

Cited By ~ 4

Author(s):

Yin Hang ◽

Hussameddine Kabban

Keyword(s):

Mobile Devices ◽

Thermal Management

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Personnel/Committee

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100119 ◽

2015 ◽

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A dynamic model of failure scenarios of the dry cooler in a liquid cooled chiller-less data center

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100149 ◽

2015 ◽

Cited By ~ 3

Author(s):

Tianyi Gao ◽

Milnes David ◽

James Geer ◽

Roger Schmidt ◽

Bahgat Sammakia

Keyword(s):

Dynamic Model ◽

Data Center

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Application of a multilevel unstructured staggered solver to thermal electronic simulations

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100174 ◽

2015 ◽

Cited By ~ 1

Author(s):

Viacheslav Semin ◽

Mark Bardsley ◽

Oliver Rosten ◽

Chris Aldham

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2015 THERMI Awards [2 awards]

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100120 ◽

2015 ◽

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Back cover

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100185 ◽

2015 ◽

Keyword(s):

Back Cover

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An efficient transient thermal model for electronics thermal management based on singular value decomposition

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100173 ◽

2015 ◽

Author(s):

Xiao Hu ◽

Sivasubramani Krishnaswamy ◽

Saeed Asgari ◽

Scott Stanton

Keyword(s):

Singular Value Decomposition ◽

Thermal Management ◽

Thermal Model ◽

Singular Value ◽

Value Decomposition ◽

Transient Thermal

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2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100128 ◽

2015 ◽

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2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100126 ◽

2015 ◽

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Front cover

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2015.7100114 ◽

2015 ◽

Keyword(s):

Front Cover

Download Full-text

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal management in mobile devices: challenges and solutions

Personnel/Committee

A dynamic model of failure scenarios of the dry cooler in a liquid cooled chiller-less data center

Application of a multilevel unstructured staggered solver to thermal electronic simulations

2015 THERMI Awards [2 awards]

Back cover

An efficient transient thermal model for electronics thermal management based on singular value decomposition

Advertisement [Dow Corning]

Advertisement [6SigmaET]

Front cover

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
Latest Publications