2010 International Symposium on Advanced Packaging Materials: Microtech (APM)
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15

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3

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Published By IEEE

9781424467563

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Computational modelling of electrical field intensity for high voltage semiconductor package design

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441380 ◽

2010 ◽

Author(s):

N. S. Nobeen ◽

D. C. Whalley ◽

D. A. Hutt ◽

B. Haworth

Keyword(s):

Field Intensity ◽

High Voltage ◽

Computational Modelling ◽

Electrical Field ◽

Package Design ◽

Electrical Field Intensity

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Optimization of stiffness for isotropic conductive adhesives

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441385 ◽

2010 ◽

Author(s):

Chune Fu ◽

Si Chen ◽

Par Berggren ◽

Qiong Fan ◽

Wenhui Du ◽

...

Keyword(s):

Conductive Adhesives ◽

Isotropic Conductive Adhesives

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Capacitive sensor for automotive engine oil degradation using wireless network

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441375 ◽

2010 ◽

Author(s):

Jaedong Cho ◽

Sekwang Park

Keyword(s):

Wireless Network ◽

Capacitive Sensor ◽

Oil Degradation ◽

Automotive Engine

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Single sided substrates and packages based on laminate materials

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441386 ◽

2010 ◽

Author(s):

Bernd K. Appelt ◽

Bruce Su ◽

Alex S.F. Huang ◽

Tony Hsieh ◽

Yi-Shao Lai

Keyword(s):

Laminate Materials

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Graphite nanoplatelet/silicone composites for thermal interface applications

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441382 ◽

2010 ◽

Author(s):

M.A. Raza ◽

A.V.K. Westwood ◽

C. Stirling

Keyword(s):

Thermal Interface

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Nano- und micro sized filler particles for improved humidity resistance of encapsulants

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441384 ◽

2010 ◽

Author(s):

T. Braun ◽

J. Bauer ◽

L. Georgi ◽

K.-F. Becker ◽

M. Koch ◽

...

Keyword(s):

Humidity Resistance ◽

Filler Particles

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A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441383 ◽

2010 ◽

Author(s):

Huaxiang Lai ◽

Xiuzhen Lu ◽

Si Chen ◽

Chune Fu ◽

Johan Liu

Keyword(s):

Conductive Adhesive ◽

Sic Nanoparticles ◽

Isotropic Conductive Adhesive

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Packaging of LED backlights for ruggedised displays

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441377 ◽

2010 ◽

Author(s):

C Bailey ◽

Y Lee ◽

H Lu ◽

N Strusevich ◽

C Yin

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Optical fibre array manufacture using electrostatic actuation

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441376 ◽

2010 ◽

Author(s):

Dominik Weiland ◽

Markus Luetzelschwab ◽

Eitan Abraham ◽

Marc P.Y. Desmulliez ◽

Peter Molter ◽

...

Keyword(s):

Optical Fibre ◽

Electrostatic Actuation

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Bespoke interconnect technologies for optoelectronic and biomedical products

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441388 ◽

2010 ◽

Author(s):

Marc P.Y. Desmulliez ◽

David Flynn

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