Active thermal interface graphene nanocomposites for thermal control of electronic and power devices

New experimental and calculated data are presented for active thermal interface materials, in which heat is removed not only due to high thermal conductivity, but also due to the evaporation of liquids, for example, water, inside a nanoporous graphene structure. It is shown that such active thermal interfaces may be new systems of active thermal control.

Thermal Conductivity Determination of Ga-In Alloys for Thermal Interface Materials Design

Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications. In this work, the thermal conductivities of different phase regions in the Ga-In system at various compositions and temperatures are measured for the first time. A modified comparative cut bar technique is used for the measurement of the thermal conductivities of GaxIn1−x (x = 0, 0.1, 0.214, 0.3, and 0.9) alloys at 40, 60, 80, and 100 °C, the temperatures commonly encountered in consumer electronics. The thermal conductivity of liquid and semi-liquid (liquid + β) Ga-In alloys are higher than most of the TIM’s currently used in consumer electronics. These measured quantities, along with the available experimental data from literature, served as input for the thermal conductivity parameter optimization using the CALPHAD (calculation of phase diagrams) method for pure elements, solution phase, and two-phase region. A set of self-consistent parameters for the description of the thermal conductivity of the Ga-In system is obtained. There is good agreement between the measured and calculated thermal conductivities for all of the phases. Due to their ease of manufacturing and high thermal conductivity, liquid/semi-liquid Ga-In alloys have significant potential for TIM in consumer electronics.

Modeling of thermal processes in the contact zones of fuel elements

In this work, using two specific examples, a general approach to the mathematical modeling of thermal processes in the contact zones of fuel elements in the development and optimization of various technological processes, systems and devices is considered. In the first example, a mathematical model of heat transfer in the contact zone (metal-hybrid thermal interface) between the heat-generating element and the heat-dissipating radiator is considered. In the second case, the thermal process in the processing of materials with a bonded diamond tool in the contact zone "diamond grain – binder – processed material" is considered and analyzed. The general approach to modeling thermal processes in the contact zones of various fuel elements makes it possible to optimize the parameters of technological processing modes and the correct operating conditions for products and systems

Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

The microstructural change of graphite was studied after ultrasonic treatment of the graphite. When the graphite solution was treated with varying ultrasonic power and time, the microstructure changed gradually, and accordingly, the thermal conductivity characteristics of the composite containing the as-treated graphite was also different with each other. Thermal conductivity showed the best result in the silicone composite containing graphite prepared under the optimum condition of ultrasonic treatment, and the thermal conductivity of the composite improved proportionally along with the particle size of graphite. When the silicone composite was prepared by using a mixture of inorganic oxides and graphite rather than graphite alone, the thermal conductivity of the silicone composite was further increased. A silicone composite containing graphite was used for LED (light emitting diode) lighting system as a thermal interface material (TIM), and the temperature elevation due to heat generated, while the lighting was actually operated, was analyzed.