The Theory of the Stability of the Solid-Liquid Interface under Constitutional Supercooling (II)

1966 ◽  
Vol 17 (1) ◽  
pp. 119-130 ◽  
Author(s):  
R. T. Delves
2006 ◽  
Author(s):  
Brent C. Houchens

The role of thermoelectromagnetic convection (TEMC) on the stability of a range of flows is investigated. Here we discuss the general features of TEMC, and describe experiments in which this effect is thought to have significance. The general formulation for TEMC at a solid-liquid interface is presented. Initial results are benchmarked with existing analytical and numerical solutions.


2012 ◽  
Vol 192-193 ◽  
pp. 109-115 ◽  
Author(s):  
Sarah George ◽  
Robert Knutsen

High purity aluminium has been successfully rheocast using the CSIR-RCS system combined with high pressure die casting. Analysis of the as-cast microstructure by SEM and EBSD revealed the presence of in-grain substructures. These morphological features show that the overall growth mode of the globular grains during rheocasting is planar, but the presence of these features indicates that the solidification mode is cellular at some stages during the slurry production process. Cellular solidification is associated with unstable growth at the solid-liquid interface and is initiated and exacerbated by solute gradients between the melt and the newly formed solid. This high purity alloy exhibits the same cellular growth, indicating that even minor solute variations have an effect on the stability of the solid-liquid interface and, hence, the mode of solidification during semi-solid rheocasting.


Author(s):  
Yousef M. F. El Hasadi ◽  
J. M. Khodadadi

Nanoparticle-enhanced phase change materials (NEPCM) were proposed recently as alternatives to conventional phase change materials due to their enhanced thermophysical properties. In this study, the effect of the size of the nanoparticles on the morphology of the solid-liquid interface and evolving concentration field, during solidification had been reported. The numerical method that was used is based on the one-fluid-mixture model. The model takes into account the thermal as well as the solutal convection effects. A square cavity model was used in the simulation. The NEPCM that was composed of a suspension of copper nanoparticles in water was solidified from the bottom. The nanoparticles size used were 5 nm and 2 nm. The temperature difference between the hot and cold sides was 5 degrees centigrade and the loading of the nanoparticles that have been used in the simulation was 10% by mass. The results obtained from the model were compared with those existing in the literature, and the comparison was satisfactory. The solid-liquid interface for the case of NEPCM with 5 nm particle size was almost planar throughout the solidification process. However, for the case of the NEPCM with particle size of 2 nm, the solid-liquid interface evolved from a planar stable shape to an unstable dendritic shape, as the solidification process proceeded with time. This was attributed to the constitutional supercooling effect. It has been observed that the constitutional supercooling effect is more pronounced as the particle size decreases. Furthermore, the freezing time increases as the particle size decreases.


1985 ◽  
Vol 151 (-1) ◽  
pp. 121 ◽  
Author(s):  
Q. T. Fang ◽  
M. E. Glicksman ◽  
S. R. Coriell ◽  
G. B. McFadden ◽  
R. F. Boisvert

2013 ◽  
Vol 313-314 ◽  
pp. 245-248
Author(s):  
Ning Li ◽  
Rong Zhang ◽  
Li Min Zhang ◽  
Li Fei Du ◽  
Qian Liu

The effect of medium-density current on the morphological stability of S/L interface of Pb-80wt%Sn alloy during directional solidification was investigated. The results indicated that both the DC of positive and negative 200 Acm-2 could decrease the critical growth rate of cellular/dendrite transition and minish the range of growth rate of cellular crystal. DC accelerated the microstructure transition from cellular crystal to dendrite crystal at the same pulling rate. Furthermore, the dendrite crystal was refined by positive and negative DC at high pulling rate. The effect of direction of DC to the microstructure transition could be neglected. In conclusion, the positive and negative 200 Acm-2 decreased the stability of solid/liquid interface of Pb-80%Sn alloy, and the lower the pulling rate was applied, the more obviously DC affected the microstructure.


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