Spray forming: Copper alloys

2003 ◽  
pp. 247-257
Author(s):  
K. Hummert ◽  
H. Müller ◽  
C. Spiegelhauer
Keyword(s):  
Copper Alloys ◽  
Spray Forming

Extension of the Performance of Aluminium-Copper Alloys by Spray Forming

2004 ◽  
Vol 6 (11) ◽  
pp. 879-883 ◽  
Author(s):  
K. Schimanski ◽  
A. Schulz ◽  
H. Vetter ◽  
K. Bauckhage ◽  
P. Mayr
Keyword(s):  
Copper Alloys ◽  
Spray Forming ◽  
Aluminium Copper

Spray Forming of Copper Alloys

2017 ◽  
pp. 407-462
Author(s):  
Hilmar R. Müller ◽  
Igor Altenberger
Keyword(s):  
Copper Alloys ◽  
Spray Forming

Spray forming of aluminium-copper alloys

1991 ◽  
Vol 134 ◽  
pp. 1111-1114 ◽  
Author(s):  
P.S Grant ◽  
W.T Kim ◽  
B Cantor
Keyword(s):  
Copper Alloys ◽  
Spray Forming ◽  
Aluminium Copper

Morphology and atomic structure of segregated grain boundaries in Cu-Sb

1992 ◽  
Vol 50 (1) ◽  
pp. 254-255
Author(s):  
R. W. Fonda ◽  
D. E. Luzzi
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Intergranular Fracture ◽  
Atomic Structure ◽  
Copper Alloys ◽  
Polycrystalline Materials ◽  
Grain Boundary Embrittlement ◽  
Boundary Embrittlement

The properties of polycrystalline materials are strongly dependant upon the strength of internal boundaries. Segregation of solute to the grain boundaries can adversely affect this strength. In copper alloys, segregation of either bismuth or antimony to the grain boundary will embrittle the alloy by facilitating intergranular fracture. Very small quantities of bismuth in copper have long been known to cause severe grain boundary embrittlement of the alloy. The effect of antimony is much less pronounced and is observed primarily at lower temperatures. Even though moderate amounts of antimony are fully soluble in copper, concentrations down to 0.14% can cause grain boundary embrittlement.

TEM study of a biofilm on copper corrosion

1996 ◽  
Vol 54 ◽  
pp. 220-221
Author(s):  
W. A. Chiou ◽  
N. Kohyama ◽  
B. Little ◽  
P. Wagner ◽  
M. Meshii
Keyword(s):  
Marine Bacterium ◽  
Culture Medium ◽  
Copper Alloys ◽  
Pure Copper ◽  
Localized Corrosion ◽  
Natural Seawater ◽  
Copper Corrosion ◽  
New Approach ◽  
The Past ◽  
Copper Tolerant

The corrosion of copper and copper alloys in a marine environment is of great concern because of their widespread use in heat exchangers and steam condensers in which natural seawater is the coolant. It has become increasingly evident that microorganisms play an important role in the corrosion of a number of metals and alloys under a variety of environments. For the past 15 years the use of SEM has proven to be useful in studying biofilms and spatial relationships between bacteria and localized corrosion of metals. Little information, however, has been obtained using TEM capitalizing on its higher spacial resolution and the transmission observation of interfaces. The research presented herein is the first step of this new approach in studying the corrosion with biological influence in pure copper.Commercially produced copper (Cu, 99%) foils of approximately 120 μm thick exposed to a copper-tolerant marine bacterium, Oceanospirillum, and an abiotic culture medium were subsampled (1 cm × 1 cm) for this study along with unexposed control samples.

THE ELECTRICAL RESISTIVITY AND THERMOPOWER OF NICKEL-COPPER ALLOYS

1974 ◽  
Vol 35 (C4) ◽  
pp. C4-223-C4-226 ◽  
Author(s):  
H. M. AHMAD ◽  
D. GREIG
Keyword(s):  
Electrical Resistivity ◽  
Copper Alloys ◽  
Nickel Copper

Quantification of the Impact of Strontium on the Solidification Path of the Aluminum-Silicon-Copper Alloys Using Thermal Analysis Technique

2009 ◽  
Vol 46 (3) ◽  
pp. 137-152 ◽  
Author(s):  
Mile Djurdjevic ◽  
Glenn Byczynski ◽  
Carola Schechowiak ◽  
Hagen Stieler ◽  
Jelena Pavlovic
Keyword(s):  
Thermal Analysis ◽  
Copper Alloys ◽  
Solidification Path ◽  
Thermal Analysis Technique ◽  
Analysis Technique ◽  
The Impact ◽  
Aluminum Silicon
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