Layer Potentials in Dynamic Bending of Thermoelastic Plates

Author(s):  
I. Chudinovich ◽  
C. Constanda
2006 ◽  
Vol 134 ◽  
pp. 725-730 ◽  
Author(s):  
A. Pignon ◽  
G. Mathieu ◽  
S. Richomme ◽  
J. M. Margot ◽  
F. Delvare

Micromachines ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 78
Author(s):  
Rafat Saleh ◽  
Maximilian Barth ◽  
Wolfgang Eberhardt ◽  
André Zimmermann

Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.


1972 ◽  
Vol 4 (4-6) ◽  
pp. 544-549
Author(s):  
B. L. Pelekh ◽  
G. A. Teters

1963 ◽  
Vol 89 (4) ◽  
pp. 95-114
Author(s):  
Herbert R. Bailey
Keyword(s):  

2021 ◽  
Vol 42 (0) ◽  
pp. 1-9
Author(s):  
SHI Jincheng ◽  
◽  
◽  
XIAO Shengzhong ◽  
◽  
...  

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