Particulate Surface Contamination and Device Failures

1987 ◽  
pp. 123-148 ◽  
Author(s):  
Joseph R. Monkowski
Keyword(s):  
Surface Contamination ◽  
Particulate Surface

Ultra-Clean Air Ionizers for Suppression of Particulate Surface Contamination

1991 ◽  
pp. 249-256
Author(s):  
Philip C. D. Hobbs ◽  
J. Samuel Batchelder ◽  
Vaughn P. Gross ◽  
Kenneth D. Murray
Keyword(s):  
Surface Contamination ◽  
Clean Air ◽  
Particulate Surface

Electrostatic Removal of Loose Particulate Surface Contamination from Historical Photographs / Elektrostatische Abnahme lose aufliegender partikulärer Verunreinigungen von historischen Photographien / Dissolution électrostatique des particules libres contaminant la surface de photographies historiques

2013 ◽  
Vol 34 (3) ◽  
Author(s):  
Marie-Louise Frank ◽  
Ernst Becker ◽  
Julia Schultz ◽  
Ulrike Hähner ◽  
Irene Brückle ◽  
...  
Keyword(s):  
Light Microscopy ◽  
Microbial Contamination ◽  
Surface Contamination ◽  
Visual Evaluation ◽  
Microbiological Methods ◽  
Microbial Contaminants ◽  
Characteristic Features ◽  
Cleaning Technology ◽  
Historical Photographs ◽  
Particulate Surface

AbstractThis article discusses the use of electrostatic cleaning technology to remove loose particulate surface contamination - which here includes microbial contaminants such as spores, conidia and hyphal fragments - from two 19th century albumen photographs mounted on cardboard. The results of this study, obtained using light microscopy, SEM/EDX and microbiological methods, as well as conservators' visual evaluation, show that the technology is fundamentally suitable for removing microbial contamination from photographic prints and their cardboard mounts. Cleaning the surface four times with electrostatically charged foils reduced the microbial contamination by up to 70%. The surface of the albumen print, which is sensitive to abrasion, was not harmed, and its characteristic features were not changed. The photographs, which were partly delaminated from the cardboard support and the mechanically weakened cardboard, could be treated without creating any additional damage.

383. Field Evaluation of a Libs Sampler for Determining Surface Contamination Due to Beryllium

2002 ◽  
Author(s):  
M. Hoover ◽  
M. McCawley ◽  
D. Yereb ◽  
S. Tinkle ◽  
S. Beaton ◽  
...  
Keyword(s):  
Field Evaluation ◽  
Surface Contamination

Studies on a Failure Analysis Flow of Surface Contamination, Corrosion, and Underetch on Microchip Al Bondpads in Wafer Fabrication

2005 ◽  
Author(s):  
Hua Younan
Keyword(s):  
Failure Analysis ◽  
Galvanic Corrosion ◽  
Surface Contamination ◽  
Wafer Fabrication ◽  
Tof Sims ◽  
Corrosion Passivation

Abstract A failure analysis flow is developed for surface contamination, corrosion and underetch on microchip Al bondpads and it is applied in wafer fabrication. SEM, EDX, Auger, FTIR, XPS and TOF-SIMS are used to identify the root causes. The results from carbon related contamination, galvanic corrosion, fluorine-induced corrosion, passivation underetch and Auger bondpad monitoring will be presented. The failure analysis flow will definitely help us to select suitable methods and tools for failure analysis of Al bondpad-related issues, identify rapidly possible root causes of the failures and find the eliminating solutions at both wafer fabrication and assembly houses.

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