Applications of The Mössbauer Effect to The Characterization of Materials

Author(s):  
Gary J. Long ◽  
Fernande Grandjean
2010 ◽  
Vol 217 ◽  
pp. 012073
Author(s):  
B Arcondo ◽  
M A Ureña ◽  
J M Conde Garrido ◽  
J A Rocca ◽  
M Fontana

Author(s):  
A. Goossens ◽  
M. W. J. CRAJÉ ◽  
A. M. Van Der Kraan ◽  
A. Zwijnenburg ◽  
M. Makkee ◽  
...  

1979 ◽  
Vol 19 (3) ◽  
pp. 1369-1373 ◽  
Author(s):  
G. S. Collins ◽  
T. Kachnowski ◽  
N. Benczer-Koller ◽  
M. Pasternak

Author(s):  
M.I. da Costa ◽  
J.I. Kunrath ◽  
J.B.M. da Cunha ◽  
J.T. Moro ◽  
J.H. de Araújo

1994 ◽  
Vol 83 (1) ◽  
pp. 463-467
Author(s):  
Moacir I. da Costa ◽  
José I. Kunrath ◽  
João B. M. da Cunha ◽  
José T. Moro ◽  
José H. de Araújo

Author(s):  
Yoshitaka Minai ◽  
Takeshi Tominaga ◽  
Takakazu Fukushima ◽  
Masaru Ichikawa

Author(s):  
Simon Thomas

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.


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