Ultrafast Laser Micro and Nano Processing of Transparent Materials—From Fundamentals to Applications

Author(s):  
Manoj Kumar Bhuyan ◽  
Koji Sugioka
2009 ◽  
Author(s):  
C. Mauclair ◽  
G. Cheng ◽  
N. Huot ◽  
E. Audouard ◽  
A. Rosenfeld ◽  
...  

2014 ◽  
Vol 6 (3) ◽  
pp. 293 ◽  
Author(s):  
Martynas Beresna ◽  
Mindaugas Gecevičius ◽  
Peter G. Kazansky

Author(s):  
Peter G. Kazansky ◽  
Martynas Beresna ◽  
Mindaugas Gecevicius ◽  
Costantino Corbari ◽  
Yasuhiko Shimotsuma ◽  
...  

2021 ◽  
Author(s):  
Daniel Flamm ◽  
Myriam Kaiser ◽  
Jonas Kleiner ◽  
Tim Hesse

We report on single-pass laser cleaving of transparent materials with C-shaped edges that exhibit 45-deg tangential angles to the surface. A holographic 3D beam splitter distributes several foci along the desired edge contours, including C-shaped edges. Single-pass, full thickness laser modifications are achieved requiring single-side access to the workpiece only without inclining the optical head. After having induced laser modifications with feed rates in the order of 100 mm/s actual separation is performed using a selective etching strategy.


2004 ◽  
Author(s):  
Z. B. Wang ◽  
Ming Hui Hong ◽  
L. Yin ◽  
Tow Chong Chong

2018 ◽  
pp. 357-398
Author(s):  
Felix Sima ◽  
Jian Xu ◽  
Koji Sugioka

2009 ◽  
Vol 17 (5) ◽  
pp. 3531 ◽  
Author(s):  
C. Mauclair ◽  
G. Cheng ◽  
N. Huot ◽  
E. Audouard ◽  
A. Rosenfeld ◽  
...  

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