Fifth All-Union Conference on Heat Exchange and Hydraulic Resistance in the Movement of a Two-Phase Stream in Elements of Power Machinery and Apparatus

1975 ◽  
Vol 28 (5) ◽  
pp. 677-678
Author(s):  
A. A. Andreevskii ◽  
G. S. Bykov ◽  
T. G. Volukhova
1971 ◽  
Vol 31 (2) ◽  
pp. 897-897
Author(s):  
E. V. Firsova ◽  
B. L. Paskar'

1980 ◽  
Vol 39 (5) ◽  
pp. 1177-1179
Author(s):  
A. A. Basovskaya ◽  
V. A. Reisig

1972 ◽  
Vol 32 (5) ◽  
pp. 465-466
Author(s):  
L. A. Adamovich ◽  
G. M. Dvorina ◽  
V. G. Sytin
Keyword(s):  

1969 ◽  
Vol 26 (1) ◽  
pp. 65-65
Author(s):  
M. V. Davydova ◽  
V. N. Zelenskii ◽  
P. L. Kirillov

1980 ◽  
Vol 49 (3) ◽  
pp. 612-615 ◽  
Author(s):  
V. K. Ivanov ◽  
L. L. Kobzar'

Author(s):  
Igor Kiselev ◽  
Sergey Urushev ◽  
Igor Ivanov ◽  
Yulia Vodopyanova

Objective: To improve reliability and endurance of semiconductor devices by means of heat exchange processes optimization of installations with evaporative air cooling. Methods: Design features analysis of cooling installations was applied. Results: The structural features of “a twophase thermal siphon” for power semiconductor devices were described. Experimental research of power blocks of semiconductor converter installations with “two-phase thermal siphon” coolers was conducted. The values of maximum permissible currents upon the application of possible button-type instrument configurations with such coolers were obtained. Practical importance: Application of “two-phase thermal siphon” evaporative air coolers will make it possible to improve weight-size parameters of converter installations.


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