Evaporation rate enhancement of water with air ions from a corona discharge

1995 ◽  
Vol 39 (1) ◽  
pp. 29-33 ◽  
Author(s):  
N. N. Barthakur ◽  
N. P. Arnold
1991 ◽  
Vol 35 (2) ◽  
pp. 67-70 ◽  
Author(s):  
Y. H. Chen ◽  
N. N. Barthakur

1998 ◽  
Vol 145 (8) ◽  
pp. 2944-2950 ◽  
Author(s):  
S. M. Sayedi ◽  
D. Landheer ◽  
L. M. Landsberger ◽  
M. Kahrizi

1985 ◽  
Vol 29 (4) ◽  
pp. 353-359 ◽  
Author(s):  
S. C. Goheen ◽  
M. G. Bissell ◽  
G. A. Rao ◽  
E. C. Larkin

Author(s):  
R. W. Vook ◽  
R. Cook ◽  
R. Ziemer

During recent experiments on Au films, a qualitative correlation between hole formation and deposition rate was observed. These early studies were concerned with films 80 to 1000A thick deposited on glass at -185°C and annealed at 170°C. In the present studies this earlier work was made quantitative. Deposition rates varying between 5 and 700 A/min were used. The effects of deposition rate on hole density for two films 300 and 700A thick were investigated.Au was evaporated from an outgassed W filament located 10 cm from a glass microscope slide substrate and a quartz crystal film thickness monitor. A shutter separating the filament from the substrate and monitor made it possible to obtain a constant evaporation rate before initiating deposition. The pressure was reduced to less than 1 x 10-6 torr prior to cooling the substrate with liquid nitrogen. The substrate was cooled in 15 minutes during which the pressure continued to drop to the mid 10-7 torr range, where deposition was begun.


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