An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment
2012 ◽
Vol 59
(1)
◽
pp. 128-134
◽
1995 ◽
Vol 10
(8)
◽
pp. 1089-1098
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Keyword(s):
2007 ◽
pp. 745-748
Keyword(s):