Microstructure and mechanical properties of Sn–xBi solder alloy

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-015-2880-z ◽

2015 ◽

Vol 26 (6) ◽

pp. 3629-3637 ◽

Author(s):

Dan Ye ◽

Chengchao Du ◽

Mingfang Wu ◽

Zhongmin Lai

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Microstructure And Mechanical Properties

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Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-021-07144-2 ◽

2021 ◽

Author(s):

Sezen Aksöz ◽

Pınar Ata Esener ◽

Esra Öztürk ◽

Necmettin Maraşlı

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Microstructure And Mechanical Properties ◽

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Role of erbium in microstructure and mechanical properties of Sn58Bi42 solder alloy

Materials Letters ◽

10.1016/j.matlet.2021.130745 ◽

2021 ◽

pp. 130745

Author(s):

Qiman Xu ◽

Xiaohan Ding ◽

Chen Chen ◽

Jian Zhou ◽

Feng Xue ◽

...

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Microstructure And Mechanical Properties

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Microstructure and mechanical properties of Sn-9Zn-xAl 2 O 3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

Materials Science and Engineering A ◽

10.1016/j.msea.2016.10.006 ◽

2016 ◽

Vol 678 ◽

pp. 252-259 ◽

Author(s):

Wen-qing Xing ◽

Xin-ye Yu ◽

Heng Li ◽

Le Ma ◽

Wei Zuo ◽

...

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Experimental Research ◽

First Principles ◽

First Principles Calculation ◽

Lead Free ◽

Lead Free Solder ◽

Microstructure And Mechanical Properties ◽

Lead Free Solder Alloy ◽

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Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2019.03.027 ◽

2019 ◽

Vol 789 ◽

pp. 805-813 ◽

Author(s):

Wenbo Zhu ◽

Weiwei Zhang ◽

Wei Zhou ◽

Ping Wu

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Microstructure And Mechanical Properties

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Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-020-04196-8 ◽

2020 ◽

Vol 31 (19) ◽

pp. 16437-16447

Author(s):

Xianwei Zeng ◽

Yichi Liu ◽

Jiankang Zhang ◽

Yi Liu ◽

Xiaowu Hu ◽

...

Keyword(s):

Mechanical Properties ◽

High Temperature ◽

Thermal Behavior ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Microstructure And Mechanical Properties ◽

Lead Free Solder Alloy ◽

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Harsh service environment effects on the microstructure and mechanical properties of Sn–Ag–Cu-1 wt% nano-Al solder alloy

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-016-5250-6 ◽

2016 ◽

Vol 27 (11) ◽

pp. 11273-11283 ◽

Author(s):

Asit Kumar Gain ◽

Liangchi Zhang

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Service Environment ◽

Environment Effects ◽

Microstructure And Mechanical Properties

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Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Materials Research ◽

10.1590/1980-5373-mr-2017-0877 ◽

2018 ◽

Vol 21 (2) ◽

Author(s):

Bismarck Luiz Silva ◽

José Eduardo Spinelli

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Microstructure And Mechanical Properties

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Effect of Ni Addition to Sn0.7Cu Solder Alloy on Thermal Behavior, Microstructure, and Mechanical Properties

Journal of Materials Engineering and Performance ◽

10.1007/s11665-018-3734-7 ◽

2018 ◽

Vol 27 (12) ◽

pp. 6564-6576

Author(s):

Yanqing Lai ◽

Xiaowu Hu ◽

Xiongxin Jiang ◽

Yulong Li

Keyword(s):

Mechanical Properties ◽

Thermal Behavior ◽

Solder Alloy ◽

Microstructure And Mechanical Properties ◽

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Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy

Microelectronics Reliability ◽

10.1016/j.microrel.2014.12.017 ◽

2015 ◽

Vol 55 (3-4) ◽

pp. 596-601 ◽

Author(s):

Li Yang ◽

Yaocheng Zhang ◽

Chengchao Du ◽

Jun Dai ◽

Ning Zhang

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Aluminum Concentration ◽

Microstructure And Mechanical Properties

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Effect of cooling method and aging treatment on the microstructure and mechanical properties of Sn–10Bi solder alloy

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-015-3903-5 ◽

2015 ◽

Vol 27 (2) ◽

pp. 1398-1407 ◽

Author(s):

Zhongmin Lai ◽

Dan Ye

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Aging Treatment ◽

Cooling Method ◽

Microstructure And Mechanical Properties

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