Microelectronics Reliability
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad

2022 ◽  
Vol 129 ◽  
pp. 114472
Author(s):  
Jungsoo Kim ◽  
Dae-Young Park ◽  
Byeongjin Ahn ◽  
Junghwan Bang ◽  
Min-Su Kim ◽  
...  
Keyword(s):  
Brittle Fracture ◽  
Solder Joint ◽  
Diffusion Barrier

Novel testability modelling and diagnosis method considering the supporting relation between faults and tests

2022 ◽  
Vol 129 ◽  
pp. 114463
Author(s):  
Junyou Shi ◽  
Yi Deng ◽  
Zili Wang
Keyword(s):  
Diagnosis Method

Process-induced warpage and stress estimation of through glass via embedded interposer carrier with ring-type framework

2022 ◽  
Vol 129 ◽  
pp. 114476
Author(s):  
Pei-Chen Huang ◽  
Yu-Min Lin ◽  
Hsing-Ning Liu ◽  
Chang-Chun Lee
Keyword(s):  
Ring Type ◽  
Stress Estimation

Gate-oxide-short defect analysis and fault modeling in FinFETs

2022 ◽  
Vol 129 ◽  
pp. 114464
Author(s):  
Roya Dibaj ◽  
Dhamin Al-Khalili ◽  
Maitham Shams ◽  
Saman Adham
Keyword(s):  
Gate Oxide ◽  
Fault Modeling ◽  
Defect Analysis ◽  
Gate Oxide Short

Novel ESD device design for STT-MRAM memory chip

2022 ◽  
Vol 129 ◽  
pp. 114474
Author(s):  
Guangjun Zhang ◽  
Yanfeng Jiang
Keyword(s):  
Device Design ◽  
Memory Chip

Electro-thermal coupling and performance estimation of LEDs at system level

2022 ◽  
Vol 129 ◽  
pp. 114462
Author(s):  
Haotian Meng ◽  
Fanmin Kong ◽  
Kang Li
Keyword(s):  
Performance Estimation ◽  
System Level ◽  
Thermal Coupling ◽  
And Performance

Impact of multi-finger MOSFET geometry on the electrical performance of RF circuits

2022 ◽  
Vol 129 ◽  
pp. 114445
Author(s):  
Sehmi Saad ◽  
Fayrouz Haddad ◽  
Aymen Ben Hammadi
Keyword(s):  
Rf Circuits ◽  
Electrical Performance

A comparative analysis of printed circuit drying methods for the reliability of assembly process

2022 ◽  
Vol 129 ◽  
pp. 114478
Author(s):  
Piotr Ciszewski ◽  
Mariusz Sochacki ◽  
Wojciech Stęplewski ◽  
Marek Kościelski ◽  
Aneta Araźna ◽  
...  
Keyword(s):  
Comparative Analysis ◽  
Drying Methods ◽  
Assembly Process ◽  
Printed Circuit

A cost-effective repair scheme for clustered TSV defects in 3D ICs

2022 ◽  
Vol 129 ◽  
pp. 114460
Author(s):  
Dilip Kumar Maity ◽  
Surajit Kumar Roy ◽  
Chandan Giri
Keyword(s):  
Cost Effective ◽  
3D Ics

Analysis of radiation effect of a novel SOI-Like LDMOS structure

2022 ◽  
Vol 129 ◽  
pp. 114471
Author(s):  
Yang Yang ◽  
Ying Wang ◽  
Cheng-Hao Yu ◽  
Meng-Tian Bao ◽  
Fei Cao
Keyword(s):  
Radiation Effect
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