Electronic stopping power measurements using secondary ion beams

1994 ◽  
Vol 66 (1-3) ◽  
pp. 231-234 ◽  
Author(s):  
N. Nath ◽  
O.P. Dahinwal ◽  
A. Bhagwat ◽  
D.K. Avasthi ◽  
V. Harikumar ◽  
...  
Keyword(s):  
Ion Beams ◽  
Stopping Power ◽  
Power Measurements ◽  
Secondary Ion ◽  
Electronic Stopping Power

A time-of-flight method for stopping power measurements of bunched ion beams

1983 ◽  
Vol 206 (3) ◽  
pp. 609-612 ◽  
Author(s):  
H. Geissel ◽  
Y. Laichter ◽  
R. Albrecht ◽  
T. Kitahara ◽  
J. Klabunde ◽  
...  
Keyword(s):  
Time Of Flight ◽  
Ion Beams ◽  
Stopping Power ◽  
Power Measurements ◽  
Time Of Flight Method

scholarly journals The dependence of heavy-ion-induced adhesion on energy loss and time

1986 ◽  
Vol 1 (2) ◽  
pp. 231-233 ◽  
Author(s):  
R.G. Stokstad ◽  
P.M. Jacobs ◽  
I. Tserruya ◽  
L. Sapir ◽  
G. Mamane
Keyword(s):  
Energy Loss ◽  
Gold Film ◽  
Peel Test ◽  
Heavy Ion ◽  
Ion Beams ◽  
Stopping Power ◽  
Metallic Films ◽  
Thin Gold Film ◽  
Native Oxides ◽  
Electronic Stopping Power

The ability of heavy-ion beams to enhance the adhesion of thin metallic films to substrates has been studied as a function of projectile species. Measurements of the adhesion enhancement of a thin gold film to substrates of tantalum and silicon (with native oxides) have been made for beams of 12C, 16O, 28Si, 35Cl, and 58Ni at 2.85 MeV/nucleon. The threshold dose required to pass the Scotch tape peel test was found for the Au-Ta system to be D th (cm−2) = 1017 (dE / dx)−3±0.2 where dE/dx is the electronic stopping power (MeV mg−1 cm−2) of the ion in Au. For the Au-Si system, Dth = 6×1018 (dE/dx)−4.1±0.3. The steep dependence of D th on dE/dx found here is in contrast with an earlier measurement for the Au-Ta system by Tombrello et al. The adhesion enhancement was observed to decrease with time after the bombardment in a manner suggesting that diffusion of atoms through the gold film is important. The possible importance of small concentrations of extraneous atoms at the interface is discussed.

Does continuous trail of damage appear at the change in the electronic stopping power damage rate?

1990 ◽  
Vol 68 (4) ◽  
pp. 1545-1549 ◽  
Author(s):  
M. Toulemonde ◽  
N. Enault ◽  
Jin Yun Fan ◽  
F. Studer
Keyword(s):  
Stopping Power ◽  
Damage Rate ◽  
Electronic Stopping Power
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