Thermomechanical behavior of polymeric periodic structures

2021 ◽  
pp. 102512
Author(s):  
Tark Raj Giri ◽  
Russell W. Mailen
Keyword(s):  
Periodic Structures ◽  
Thermomechanical Behavior

Driven periodic structures in random environment

1999 ◽  
Vol 09 (PR10) ◽  
pp. Pr10-85-Pr10-87
Author(s):  
V. M. Vinokur
Keyword(s):  
Random Environment ◽  
Periodic Structures

On the linear theory of waves in media with periodic structures

1991 ◽  
Vol 161 (9) ◽  
pp. 201-209 ◽  
Author(s):  
Polina S. Landa ◽  
V.F. Marchenko
Keyword(s):  
Linear Theory ◽  
Periodic Structures

Temperature-Dependent Die Warpage Measurements Up to 400°C

2017 ◽  
Author(s):  
Tobias Mittereder ◽  
Bernhard Ferstl ◽  
Terry Heidmann ◽  
Christian Hollerith
Keyword(s):  
Data Acquisition ◽  
White Light ◽  
State Of The Art ◽  
Thermomechanical Behavior ◽  
Temperature Dependent ◽  
Optical Access

Abstract Temperature-dependent die warpage measurements show the possibility to analyze the thermomechanical behavior during assembly, e.g. within soldering processes. The warpage data acquisition is realized by confocal chromatic white light profilometry in combination with a precision heating/cooling chuck encapsulated in a chamber with optical access. The combination of these two tools allows precise die warpage evaluation under varied device temperature up to +400°C. This method helps to solve emerging challenges due to warpage during assembly of state of the art packages including thin dies and stacked dies as in e.g. 3D-SIPs.

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