thermomechanical behavior
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Author(s):  
Lahis Souza de Assis ◽  
Matheus Fernandes Dal Sasso ◽  
Michèle Cristina Resende Farage ◽  
Flávia de Souza Bastos ◽  
Anne-Lise Beaucour

Abstract Concrete is a widespread material all over the world. Due to this material’s heterogeneity and structural complexity, predicting the behavior of concrete structures under extreme environmental conditions is a very challenging task. High temperatures lead to microstructural changes which affect the macrostructural performance. In this context, computational tools that allow the simulation of structures may assist the analysis, by reproducing varied situations of thermal and mechanical loading and boundary conditions. In order to contribute to this scenario, this study proposes a numerical methodology to simulate the thermomechanical behavior of concrete under temperature gradients, through inverse analyses and a user subroutine implemented in Abaqus software. Thermal loading effects were considered as loading data for a damage model. Experimental data available in the literature was adopted for adjustment and validation purposes. The preliminary results presented herein encourage further improvements so as to allow realistic simulations of such an important aspect of concrete’s behavior.


Author(s):  
Jae-Hyuk Choi ◽  
Wonbo Shim ◽  
Chul Hong Rhie ◽  
Woong-Ryeol Yu

Abstract Accurate prediction of the cure level of thermoset polymers is essential to simulate the thermomechanical behavior of polymeric thermoset sealants, which is strongly dependent on cure level. Conventional cure kinetics models, however, fail to accurately predict the cure levels of thermoset sealants subjected to a complex temperature program. Herein, we propose a new cure kinetics model that greatly enhances cure level predictability by considering temperature derivatives. The validity of our model was verified by simulating the thermomechanical behavior of a polymeric sealant using a user material subroutine (UMAT) of ABAQUS software. Experimental results from an appropriately designed thermomechanical test were compared with simulation results obtained from the UMAT.


Author(s):  
V. A. Sheremet’ev ◽  
O. B. Akhmadkulov ◽  
V. S. Komarov ◽  
A. V. Korotitskii ◽  
K. E. Lukashevich ◽  
...  

2021 ◽  
Vol 54 (6) ◽  
Author(s):  
Hamza Samouh ◽  
Shunsuke Ishikawa ◽  
Osamu Kontani ◽  
Kenta Murakami ◽  
Shoji Nishimoto ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (20) ◽  
pp. 5973
Author(s):  
Qian Jiang ◽  
Abhishek Nitin Deshpande ◽  
Abhijit Dasgupta

Heterogeneous integration is leading to unprecedented miniaturization of solder joints, often with thousands of joints within a single package. The thermomechanical behavior of such SAC solder joints is critically important to assembly performance and reliability, but can be difficult to predict due to the significant joint-to-joint variability caused by the stochastic variability of the arrangement of a few highly-anisotropic grains in each joint. This study relies on grain-scale testing to characterize the mechanical behavior of such oligocrystalline solder joints, while a grain-scale modeling approach has been developed to assess the effect of microstructure that lacks statistical homogeneity. The contribution of the grain boundaries is modeled with isotropic cohesive elements and identified by an inverse iterative method that extracts material properties by comparing simulation with experimental measurements. The properties are extracted from the results of one test and validated by verifying reasonable agreement with test results from a different specimen. Equivalent creep strain heterogeneity within the same specimen and between different specimens are compared to assess typical variability due to the variability of microstructure.


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