scholarly journals Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling

2018 ◽  
Vol 188 ◽  
pp. 470-492 ◽  
Author(s):  
S. Msolli ◽  
A. Baazaoui ◽  
J. Alexis ◽  
H.S. Kim
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Electronic Packaging ◽  
Power Electronic ◽  
Shear Tests ◽  
Element Modeling ◽  
Fracture Modes ◽  
Damage And Fracture

Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling

2020 ◽  
Vol 280 ◽  
pp. 128598 ◽  
Author(s):  
Guangshu Li ◽  
Chaohui Wang ◽  
Huanyu Zhang ◽  
Mingxiang Zhuang ◽  
Zhongchao Hu ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Composite Coating ◽  
Electronic Packaging ◽  
Preliminary Design ◽  
Element Modeling ◽  
Al Composite

Exact First Order Finite Element Modeling for Eddy Current NDE

1991 ◽  
Vol 3 (1) ◽  
pp. 235-253 ◽  
Author(s):  
L. D. Philipp ◽  
Q. H. Nguyen ◽  
D. D. Derkacht ◽  
D. J. Lynch ◽  
A. Mahmood
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Eddy Current ◽  
Element Modeling ◽  
First Order ◽  
Eddy Current Nde
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