Experimental investigation of high temperature thermal contact resistance between high thermal conductivity C/C material and Inconel 600

2015 ◽  
Vol 80 ◽  
pp. 407-410 ◽  
Author(s):  
Donghuan Liu ◽  
Yan Luo ◽  
Xinchun Shang
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
High Temperature ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Inconel 600

High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Trade Off

The Effect of Thermal Conductivity of Plating Material on Thermal Contact Resistance

1970 ◽  
Vol 92 (3) ◽  
pp. 475-481 ◽  
Author(s):  
B. Mikic ◽  
G. Carnasciali
Keyword(s):  
Thermal Conductivity ◽  
Stainless Steel ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Base Material ◽  
High Thermal Conductivity ◽  
Order Of Magnitude ◽  
Contact Size ◽  
Single Contact

Plating of a base material of low thermal conductivity with materials of high thermal conductivity was considered. The solution for an elemental heat channel (single contact) is given. Experimental results for contact resistance of a plated single contact agreed well with the prediction. In general, results indicate that considerable reduction in thermal contact resistance can be achieved by plating; for example, stainless steel plated with copper of a thickness of the order of the contact size radius will reduce the resistance by more than an order of magnitude. A procedure is presented for extending the results for a plated elemental heat channel to the calculation of thermal contact resistance for nominally flat-plated surfaces in a vacuum.

Through-Plane Thermal Conductivity of PEMFC Porous Transport Layers

2010 ◽  
Vol 8 (2) ◽  
Author(s):  
Odne S. Burheim ◽  
Jon G. Pharoah ◽  
Hannah Lampert ◽  
Preben J. S. Vie ◽  
Signe Kjelstrup
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Residual Water ◽  
Order Of Magnitude ◽  
Thermal Conductivities

We report the through-plane thermal conductivities of the several widely used carbon porous transport layers (PTLs) and their thermal contact resistance to an aluminum polarization plate. We report these values both for wet and dry samples and at different compaction pressures. We show that depending on the type of PTL and the existence of residual water, the thermal conductivity of the materials varies from 0.15 W K−1 m−1 to 1.6 W K−1 m−1, one order of magnitude. This behavior is the same for the contact resistance varying from 0.8 m2 K W−1 to 11×10−4 m2 K W−1. For dry PTLs, the thermal conductivity decreases with increasing polytetrafluorethylene (PTFE) content and increases with residual water. These effects are explained by the behavior of air, water, and PTFE in between the PTL fibers. It is also found that Toray papers of differing thickness exhibit different thermal conductivities.

scholarly journals Effects of pressure and temperature on thermal contact resistance between different materials

2015 ◽  
Vol 19 (4) ◽  
pp. 1369-1372 ◽  
Author(s):  
Zhe Zhao ◽  
Hai-Ming Huang ◽  
Qing Wang ◽  
Song Ji
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Experimental Approach ◽  
Phenolic Resin ◽  
Thermal Conductivity Coefficient ◽  
Thermal Contact ◽  
Carbon Composites ◽  
Interfacial Temperature ◽  
Temperature And Pressure

To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.

Sign in / Sign up

Export Citation Format

Share Document