Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing
2007 ◽
Vol 107
(1)
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pp. 88-103
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2012 ◽
Vol 39
(5)
◽
pp. 5727-5738
◽
2012 ◽
Vol 39
(3)
◽
pp. 2590-2596
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Keyword(s):
Keyword(s):
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Keyword(s):
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