In-plane failure mechanisms and strength design of circular steel tubular Vierendeel truss arches with rectangular section

Structures ◽  
2021 ◽  
Vol 29 ◽  
pp. 1779-1790
Author(s):  
Minjie Shi ◽  
Bo Yuan ◽  
Tengzhao Jiang ◽  
Yanhui Wei
2007 ◽  
Vol 18-19 ◽  
pp. 13-19
Author(s):  
J.M. Akande ◽  
M.A. Idris

Rock slope failure mechanisms were assessed in this study using KOPEC and RCC quarries as case studies in Oyo state. Discontinuities such as joints and bedding planes were obtained through face mapping and scanline survey of the excavated slopes of the quarries. Stereographic projections of the discontinuities were generated using ROCKPACK III and the stereonets analyzed in accordance with Markland’s plane failure analysis. The results of the analyses show that there are possibilities of plane failures in the south- east region of KOPEC quarry slope face and south –west region of RCC quarry slope face. It is therefore recommended that constant monitoring of the slope failure should be done and the slope angle should be less than 700 and 600 for KOPEC quarry and RCC quarry respectively.


2011 ◽  
Vol 93 (11) ◽  
pp. 2706-2713 ◽  
Author(s):  
C. Santiuste ◽  
H. Miguélez ◽  
X. Soldani

2010 ◽  
pp. 615-622
Author(s):  
Y Pi ◽  
M Bradford ◽  
C Liu ◽  
Y Wang

Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


Author(s):  
Robert C. Cieslinski ◽  
H. Craig Silvis ◽  
Daniel J. Murray

An understanding of the mechanical behavior polymers in the ductile-brittle transition region will result in materials with improved properties. A technique has been developed that allows the realtime observation of dynamic plane stress failure mechanisms in the transmission electron microscope. With the addition of a cryo-tensile stage, this technique has been extented to -173°C, allowing the observation of deformation during the ductile-brittle transition.The technique makes use of an annealed copper cartridge in which a thin section of bulk polymer specimen is bonded and plastically deformed in tension in the TEM using a screw-driven tensile stage. In contrast to previous deformation studies on solvent-cast films, this technique can examine the frozen-in morphology of a molded part.The deformation behavior of polypropylene and polypropylene impact modified with EPDM (ethylene-propylene diene modified) and PE (polyethylene) rubbers were investigated as function of temperature and the molecular weight of the impact modifier.


PCI Journal ◽  
2003 ◽  
Vol 48 (5) ◽  
pp. 62-74 ◽  
Author(s):  
Panya Noppakunwijai ◽  
Maher K. Tadros ◽  
Chuanbing Sun

PCI Journal ◽  
1976 ◽  
Vol 21 (2) ◽  
pp. 78-81
Author(s):  
Alex Aswad

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