Characterization and analysis of diffusion bonding process in a Cr25Ni7Mo4MnSi duplex stainless steel

2018 ◽  
Vol 34 ◽  
pp. 603-613 ◽  
Author(s):  
Xueping Ren ◽  
Xiaohui Chen ◽  
Zhiping Xiong
Keyword(s):  
Stainless Steel ◽  
Duplex Stainless Steel ◽  
Diffusion Bonding ◽  
Bonding Process

The effect of thermal cycling in superplastic diffusion bonding of heterogeneous duplex stainless steel

2016 ◽  
Vol 96 ◽  
pp. 499-505 ◽  
Author(s):  
Haitao Qu ◽  
Hongliang Hou ◽  
Pengfei Li ◽  
Shuxia Li ◽  
Xueping Ren
Keyword(s):  
Stainless Steel ◽  
Thermal Cycling ◽  
Duplex Stainless Steel ◽  
Diffusion Bonding

scholarly journals Investigation on the physical properties and diffusion layer phase transformation at the interface of Sialon-Duplex Stainless-Steel bonding

2021 ◽  
Vol 15 (3) ◽  
pp. 8450-8458
Author(s):  
Mohamed Ahmed Rady ◽  
Patthi Hussain ◽  
Nagoor Basha Shaik ◽  
Balaji Bakthavatchalam
Keyword(s):  
Stainless Steel ◽  
Phase Transformation ◽  
Physical Properties ◽  
Duplex Stainless Steel ◽  
Diffusion Layer ◽  
Diffusion Bonding ◽  
Research Work ◽  
Hot Press ◽  
Press Bonding ◽  
And Diffusion

Joining SiALON to duplex stainless steel utilizes the properties of two materials which may provide an opportunity for distinctive applications. Ceramic is hard and operates at a high temperature but it is brittle whereas metal is tough but it can work at a low temperature. The benefits of the best properties of both materials can be utilized by joining them. The objectives of the research work are to investigate the physical properties and the phase transformation at the interface and at the inter-diffusion layer in between the SiAlON and duplex stainless steel. The experiment incorporated nitriding, then diffusion bonding the duplex stainless steel using the hot press. Bonding was carried out at 1200°C for the holding times of 30 minutes and 1 hour.  Metallography and micro analyses were conducted to achieve the above objectives. The study has demonstrated that 30 minutes joining time is sufficient to develop the thickness of the interface. However, 1 hour joining duration achieved cohesive and sound diffusion bonding of the SiAlON to duplex stainless steel. This is possible due to the formation of diffusion interlayer which accommodates the residual stress presence during cooling down process.

Diffusion Bonding of 3Y-TZP and SUS440 by Using of Ti-Cu Powder/Sheet

2011 ◽  
Vol 314-316 ◽  
pp. 957-962
Author(s):  
Dong Ying Ju ◽  
Ming Zhao
Keyword(s):  
Residual Stress ◽  
Stainless Steel ◽  
Chemical Bonding ◽  
Diffusion Bonding ◽  
Bonding Process ◽  
Bonding Interface ◽  
Brass Powder ◽  
Bonding Method ◽  
Xrd Method

This paper is mainly a study the diffusion bonding of 3Y-TZP/SUS440 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS440, the Ti-Cu (brass) powder/sheet was used as bonding materials. After bonding process, multi-alloy field with Fe-Ti and Fe-Cu have been confirmed by EPMA determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS440 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.

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