Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects
1993 ◽
2000 ◽
Keyword(s):
2015 ◽
Vol 26
(12)
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pp. 9226-9235
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2013 ◽
Vol 53
(9-11)
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pp. 1581-1586
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Keyword(s):